Saki’s 2DiLU1 inline bottom-side automated optical inspection (AOI) system, making use of 2D line-scan technology, is able to capture the image of an entire
460 x 500 mm printed circuit board assembly (PCBA) and carriers of 610 x 610 mm in one pass, in real-time, storing the image into memory and creating inspection data for the entire board. This versatile system automates the bottom-side inspection process, eliminates board flipping and handling and ensures quality after the potting, dip, wave and selective soldering processes.
The system software includes Saki’s proprietary Fujiyama algorithm, which provides complete through-hole joint inspection in a single step. It simultaneously inspects for copper exposure, pin detection, pin-holes, solder fillet abnormalities, missing components, soldering problems and bridges.
The system supports L-size PCBs, high clearances, heavy substrates and mounted jigs.
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