Diodes Incorporated (Diodes) has announced the PowerDI8080-5, a high current, thermally efficient power package that meets the needs of electric vehicle (EV) applications. The first product to be released in the PowerDI8080-5 package is a 40&nbps;V automotive-compliant MOSFET that features a typical RDS(ON) of just 0,54 mΩ at a gate drive of 10 V, while its gate charge is 117 nC. This performance enables designers of automotive high-power brushless DC (BLDC) motor drives, DC-DC converters, and charging systems to maximise system efficiency while ensuring power dissipation is kept to a minimum.
The PowerDI8080-5 package has a PCB footprint of 64 mm2, which is 40% less than that occupied by the TO263 package format. It also has an off-board profile of 1,7 mm, which is 63% lower than that of a TO263. The copper clip bonding between the die and the terminals facilitates a low junction-to-case thermal resistance of 0,36°C/W. This enables the PowerDI8080-5 to handle currents up to 460 A and deliver a power density that is eight times greater than a TO263 package.
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