Computer/Embedded Technology


Quectel announces high-performance 5G smart module

29 June 2022 Computer/Embedded Technology

Quectel Wireless Solutions has announced the launch of the SG560D, an Android smart module integrating 5G New Radio (NR) and artificial intelligence (AI) technologies. Featuring a powerful CPU and GPU, the SG560D will satisfy complex application scenarios that require both high data rates and computing capabilities such as in-vehicle infotainment, industrial handheld devices, smart gateways, industrial cameras and monitoring devices.

“In the era of Artificial Intelligence of Things (AIoT), computing capability becomes more critical to make devices smarter and more responsive. Our 5G SG560D module combines 5G and AI technologies to deliver state-of-the-art performance in communication and data processing,” said Patrick Qian, CEO of Quectel. “I believe the SG560D will offer an excellent option for edge computing requirements and will accelerate the digital transformation of devices.”

Powered by the Qualcomm QCM6490 chipset, Quectel’s SG560D is a 5G sub-6GHz smart module equipped with a Qualcomm Kryo 670 CPU as well as a Qualcomm Adreno 642L GPU, which together bring superior computing power to enable fast data processing. Tests indicate that the SG560D module can achieve computing performance of up to 14 trillion operations per second (TOPS).

Quectel’s SG560D contains an embedded Android 12 operating system and allows for future upgrades to the OS. It has a default onboard memory of 4 GB LPDDR4X + 64 GB UFS, with multiple memory configurations available. The product has multi-region variants including SG560D-EU for EMEA, SG560D-NA for North America, SG560D-CN for China and SG560D-WF for worldwide use.

Through the MIPI DSI interface, the SG560D can support displays with a maximum resolution of 2520 x 1080 and a refresh rate of 144 Hz. The module provides video performance offering a maximum 4K@30fps video encode and 4K@60fps video decode as well as a maximum of five groups of cameras.

Featuring 5G standalone (SA) and non-standalone (NSA) network architectures, the SG560D supports downlink 4x4 MIMO and uplink 2x2 MIMO. In addition to cellular communication capability, the SG560D supports Wi-Fi 6E bands of 2,4 GHz, 5 GHz and 6 GHz, Wi-Fi 2x2 MU-MIMO. and Bluetooth 5,2, which will significantly improve network coverage and enhance transmission data rates.

The module also contains a multi-constellation GNSS receiver and can concurrently receive signals from up to seven constellations (GPS/GLONASS/BDS/NavIC/Galileo/QZSS/SBAS). By combining GNSS signals from dual-frequency bands (L1/L5), the module can deliver fast and highly accurate positioning performance.

With various peripheral interfaces such as dual USB, multiple PCIe and UART, I2S and SPI, the SG560D offers flexibility and ease of integration to OEM developers in a wide range of AIoT applications including video conferencing systems, live streaming devices, gaming, edge computing, robots, drones, AR/VR and intelligent retail.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Vertiv expands rack PDU portfolio
Computer/Embedded Technology
Vertiv has announced its new Vertiv PowerIT rack power distribution units designed to address the rising power needs of data-intensive workloads, including AI and high-performance computing.

Read more...
ESP32-C6 achieves PSA-L2
iCorp Technologies DSP, Micros & Memory
Espressif Systems recently announced that its ESP32-C6 microcontroller has achieved PSA Certified Level 2 (PSA-L2) security certification, making it the first RISC-V-based MCU to reach this level.

Read more...
Bluetooth 6.0 module provides channel sounding
Avnet Silica Computer/Embedded Technology
The latest Bluetooth module from Panasonic Industry provides excellent performance and minimal power consumption.

Read more...
Introducing the Quectel EG800Z series
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
The EG800Z series is Quectel’s latest ultra-compact LTE Cat 1 bis module, designed to deliver reliable connectivity, low power consumption, and robust performance across a wide range of IoT applications.

Read more...
Modules upgraded with Direct-to-Cell tech
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced that several of its LTE modules are now available with Direct-to-Cell (D2C) functionality, enabling devices to seamlessly connect to satellite networks.

Read more...
Rugged PoE switch built for industrial demands
Conical Technologies Computer/Embedded Technology
The rugged Planet IGS-5225-8P4S-12V comes in a compact, rugged, and highly efficient design, making it the switch of choice for engineers working in harsh environments.

Read more...
High-performance networking for demanding environments
Electronic Products Design Computer/Embedded Technology
The Raptor-Epsilon Ethernet switch system is a ruggedised networking solution engineered to deliver advanced switching capabilities, superior reliability, and energy-efficient operation in the most demanding environments.

Read more...
Embedded platform for compute-intensive applications
iCorp Technologies DSP, Micros & Memory
The Quectel QSM368ZP-WF is a fully featured embedded ARM platform optimised for compute-intensive industrial and IoT applications.

Read more...
High performance ISM antennas
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced the launch of two new high performance ISM antennas, designed to meet the need for wireless communication in devices that operate in the industrial and commercial applications.

Read more...
Quad-band high-precision positioning module
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has recently announced the launch of the LG680P, a multi-constellation, quad-band GNSS module designed to deliver high-precision positioning across a wide range of applications.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved