Interconnection


Samtec high-speed interconnects in next-gen UAS

29 June 2022 Interconnection

UAVs, or drones, have been around for decades. Original drones resembled early-generation fighter jets controlled from the ground and used as targets for test pilots. As time passed, drones served as high-tech reconnaissance platforms and high-precision offensive weapons in military applications.

In recent years, drones have found many commercial uses as well. Popular e-commerce platforms and global retailers are using drones for order delivery. Hobbyists and tourists use commercial drones for unique photo and video opportunities. Drones are also used for numerous applications in the academic and scientific fields.

The latest commercial drones feature smaller sizes, increased functionality, and advanced AI capabilities using the latest technology. A good example of combining these innovations is the ModalAI VOXL 2 Autopilot system.

The VOXL 2 is the world’s most advanced Blue UAS Framework autopilot at its size. At only 16 g VOXL 2 boasts more AI computing than any other autopilot on the market and offers four times the computing power of the previous generation VOXL. The board integrates a PX4 real-time flight controller with an 8-core CPU, a GPU and NPU that provide a combined 15 Tera operations per second (TOPs), seven image sensors, and TDK IMUs and barometer. With support for Wi-Fi, 4G and 5G connectivity, VOXL 2 enables mission critical use cases with reliable connectivity and GPS-denied, beyond-visual-line-of-sight (BVLOS) navigation. This smaller-than-a-business-card supercomputer will enable the next generation of smaller, smarter, and safer drones.

Most of the required electronics are condensed into a single PCB on the VOXL 2 making it SWaP optimised to power the smallest drones. Using a SWaP-optimised design eliminates the time and complexity that comes with sourcing and synchronising individual components together.

The ModalAI VOXL 2 platform uses several of Samtec’s board-to-board (B2B) interconnects for the transfer of data from add-on boards. The legacy B2B connector uses Samtec’s Q Strip high-speed mezzanine connectors. These connectors have SMT signal contacts and a ground plane for improved electrical performance. Eight different stack heights are available from 5 to nbsp;300 nbsp;mm and options include guideposts for blind mate scenarios as well as alignment pins and locking clips for proper connector placement.

Samtec’s high-speed board-to-board (HSB2B) connector plays host to various add-on cards such as the debug/PCIe and the 5G add-on boards. The VOXL 2 HSB2B connector uses Samtec’s AcceleRate HD ultra-dense multi-row mezzanine strips which are rated for 56 Gbps PAM4 on a 0,635 mm pitch. They feature high-speed Edge Rate contacts designed for high-speed, high-cycle applications.

The surface of each contact is milled, creating a smooth mating surface which reduces wear thereby increasing the contact’s life cycle. This smooth mating surface also provides for lower insertion and withdrawal forces.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Designing with PCIe
Spectrum Concepts Editor's Choice Interconnection
PCI Express has become the backbone of modern high-performance systems with each new generation promising higher bandwidth, but that performance comes with a cost.

Read more...
Connectivity solutions for hydrogen technologies
Hiconnex Interconnection
As the production distribution and utilisation of hydrogen continue to scale, connectivity becomes a key enabler for efficient energy transmission, data communication, and system control.

Read more...
Robust single-pole power connectivity
Hiconnex Interconnection
Designed for cable-to-cable and cable-to-equipment use, Radiall’s single-pole power connector support current ratings from 250 A to 750 A and operating voltages up to 1000 V AC or DC.

Read more...
M12 push-pull connectors
IOT Electronics Interconnection
Phoenix Contact’s M12 push-pull connectors with internal locking set a new benchmark for fast, secure, and space-saving connectivity in industrial automation.

Read more...
Versatile outdoor waterproof connectors
Vepac Electronics Interconnection
The LP-20 outdoor waterproof connector series offers a versatile range of rugged, circular connectors with 2, 3, 4, 5, 7, 8, 9, 12 and 14-pin configurations.

Read more...
Comprehensive range of data connectors
IOT Electronics Interconnection
Phoenix Contact’s comprehensive range of data connectors provides reliable connection solutions for modern networked applications across industrial, infrastructure, and commercial environments.

Read more...
Compact inline connector for aerospace
Hiconnex Interconnection
Radiall’s Small Inline Connector series is a fully qualified wire-to-wire solution designed to simplify harness creation, installation, and modification in aerospace applications.

Read more...
Compact hybrid power storage connector
IOT Electronics Interconnection
Phoenix Contact has introduced a new hybrid connector for electrical energy storage systems, designed to combine power, signal, and data transmission in a single, compact interface.

Read more...
MIL-spec connector series
Future Electronics Interconnection
The MIL-HD2 connector series from Amphenol is the company’s next-generation, SOSA-aligned solution engineered to meet the most demanding requirements of modern military embedded systems.

Read more...
DC connectors approved for 2000 V
IOT Electronics Interconnection
Phoneix Contact’s Sunclix DC connectors are now approved for system voltages of up to 2000 V in accordance with TÜV Rheinland’s new test specification, opening the door to higher-voltage PV designs and reduced system costs.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved