Interconnection


Samtec high-speed interconnects in next-gen UAS

29 June 2022 Interconnection

UAVs, or drones, have been around for decades. Original drones resembled early-generation fighter jets controlled from the ground and used as targets for test pilots. As time passed, drones served as high-tech reconnaissance platforms and high-precision offensive weapons in military applications.

In recent years, drones have found many commercial uses as well. Popular e-commerce platforms and global retailers are using drones for order delivery. Hobbyists and tourists use commercial drones for unique photo and video opportunities. Drones are also used for numerous applications in the academic and scientific fields.

The latest commercial drones feature smaller sizes, increased functionality, and advanced AI capabilities using the latest technology. A good example of combining these innovations is the ModalAI VOXL 2 Autopilot system.

The VOXL 2 is the world’s most advanced Blue UAS Framework autopilot at its size. At only 16 g VOXL 2 boasts more AI computing than any other autopilot on the market and offers four times the computing power of the previous generation VOXL. The board integrates a PX4 real-time flight controller with an 8-core CPU, a GPU and NPU that provide a combined 15 Tera operations per second (TOPs), seven image sensors, and TDK IMUs and barometer. With support for Wi-Fi, 4G and 5G connectivity, VOXL 2 enables mission critical use cases with reliable connectivity and GPS-denied, beyond-visual-line-of-sight (BVLOS) navigation. This smaller-than-a-business-card supercomputer will enable the next generation of smaller, smarter, and safer drones.

Most of the required electronics are condensed into a single PCB on the VOXL 2 making it SWaP optimised to power the smallest drones. Using a SWaP-optimised design eliminates the time and complexity that comes with sourcing and synchronising individual components together.

The ModalAI VOXL 2 platform uses several of Samtec’s board-to-board (B2B) interconnects for the transfer of data from add-on boards. The legacy B2B connector uses Samtec’s Q Strip high-speed mezzanine connectors. These connectors have SMT signal contacts and a ground plane for improved electrical performance. Eight different stack heights are available from 5 to nbsp;300 nbsp;mm and options include guideposts for blind mate scenarios as well as alignment pins and locking clips for proper connector placement.

Samtec’s high-speed board-to-board (HSB2B) connector plays host to various add-on cards such as the debug/PCIe and the 5G add-on boards. The VOXL 2 HSB2B connector uses Samtec’s AcceleRate HD ultra-dense multi-row mezzanine strips which are rated for 56 Gbps PAM4 on a 0,635 mm pitch. They feature high-speed Edge Rate contacts designed for high-speed, high-cycle applications.

The surface of each contact is milled, creating a smooth mating surface which reduces wear thereby increasing the contact’s life cycle. This smooth mating surface also provides for lower insertion and withdrawal forces.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Omniball through-hole contacts
Spectrum Concepts Interconnection
Mill-Max has introduced an expansion to its Omniball spring-loaded contact range with a new series of through-hole mount Omniball pins designed for robust and versatile interconnect solutions.

Read more...
Phoenix’s Push-X range is growing
Phoenix Contact Interconnection
With the new XT 1,5 terminal blocks, Phoenix Contact is extending the series to include versions for conductor cross-sections from 0,34 to 2.5 mm2.

Read more...
Connector range for demanding environments
Future Electronics Interconnection
TE Connectivity’s DEUTSCH connector range offers high-performance interconnect solutions engineered for demanding environments where reliability and durability are essential.

Read more...
The mechanical side of power
Spectrum Concepts Interconnection
[Sponsored] Power delivery has always been a key requirement of electronic systems, but the way power is generated, distributed, and consumed is changing rapidly with renewable energy installations and energy storage systems introducing new power sources.

Read more...
Magnetic connectors with 2,54 mm pitch
Spectrum Concepts Interconnection
This expansion of the company’s Maxnetic product line delivers next-generation high reliability magnetic connectors designed for use in ever shrinking electronic devices and their applications.

Read more...
Reliable connectivity in harsh environments
Future Electronics Interconnection
The ecomate family of circular, multiway connectors from Amphenol delivers exceptional durability, safety, and versatility for power and signal applications.

Read more...
Cylindrical interconnects with multiple configurations
Startech Industrial Interconnection
Part of the renowned 5015 family of cylindrical interconnects, 97 Series connectors from Amphenol offer an exceptional range of customisation options to meet diverse connectivity needs across multiple industries.

Read more...
Trunk line fusion splicer
Interconnection
The JILONG 280T All-Rounder Middle Trunk Line fusion splicer is a rugged, high-performance fibre optic fusion tool engineered for core networks, FTTx, and access infrastructure.

Read more...
Understanding and controlling impedance in high-speed interconnects
Spectrum Concepts Interconnection
[Sponsored] As data rates move well into the hundreds of gigabits per second, success increasingly depends on an invisible but critical factor: impedance.

Read more...
Low profile spring-loaded connectors
Spectrum Concepts Interconnection
Mill-Max has announced the introduction of low-profile, surface mount additions to its 2 mm pitch spring-loaded connector range.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved