The SG560D is a series of Quectel’s new generation multi-mode 5G smart modules with built-in Android 12 OS. Based on QCM6490 high-performance 64-bit octa-core processors with a built-in Adreno 643 GPU, it is ideal for both industrial and consumer applications requiring high data rates and multimedia functions.
“In the era of Artificial Intelligence of Things (AIoT), computing capability becomes more critical to make devices smarter and more responsive. Our 5G SG560D module combines 5G and AI technologies to deliver state-of-the-art performance in communication and data processing,” said Patrick Qian, CEO of Quectel. “I believe the SG560D will offer an excellent option for edge computing requirements and will accelerate the digital transformation of devices.”
The module supports 3GPP Rel-15 technology and supports both 5G NSA and SA modes with 4G/3G fallback. In addition, the module supports Wi-Fi 6E & DBS, IEEE 802.11a/b/g/n/ac/ax, Wi-Fi 2 × 2 MU-MIMO and Bluetooth 5.2.
The SG560D series supports 5G and LTE multi-user multiple-input multiple-output (MU-MIMO) technology. The use of multiple antennas at the receiver end at the same time and on the same frequency band greatly minimises errors and optimises the data speed. This module also combines high-speed wireless connectivity with an embedded multi-constellation and high-sensitivity GNSS (GPS, GLONASS, BDS, NavIC, Galileo, QZSS, SBAS) receiver for positioning.
A rich set of interfaces (such as LCM, camera, touch panel, PCIe, UART, USB, I2C, and I2S) allow the module to serve a wide range of M2M applications including as a smart gateway, CPE, MiFi, MID, PND, POS, router, multimedia terminal, digital signage and industrial PDAs.
NVDC power-path control to 1– 6 cell battery systems iCorp Technologies
Power Electronics / Power Management
SG Micro’s SGM41581 is an I2C-controlled narrow voltage direct charging buck boost charge controller designed to simplify robust power delivery in systems that must seamlessly operate from an adapter input or a battery pack.
Read more...GigaDevice expands GD25UF Series density NuVision Electronics
DSP, Micros & Memory
GigaDevice has announced the expanded density range of its GD25UF series 1,2 V ultra-low power SPI NOR Flash, now spanning from 8 Mb to 256 Mb.
Read more...ARINC 429 line driver evaluation board ASIC Design Services
DSP, Micros & Memory
Holt Integrated Circuits have announced the release of the ADK-85104 Evaluation Board, a compact, ready-to-use platform designed to help engineers rapidly evaluate and characterise Holt’s HI-85104.
Read more...Highly integrated 24-channel mixed signal IC EBV Electrolink
DSP, Micros & Memory
Microchip Technology has announced the LX4580, a 24-channel mixed-signal IC designed to replace multiple discrete components with a single device that supports synchronised data acquisition, fault monitoring, and motor control.
Read more...Wi-Fi 7 tri-band connectivity module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel has introduced the FCE870Q, a compact short range wireless connectivity module designed for next generation IoT devices that require high throughput, low latency, and reliable operation in dense wireless environments.
Read more...Lower-power Thread and BLE connectivity iCorp Technologies
DSP, Micros & Memory
Espressif has released the ESP32-H21, a low-power wireless SoC aimed at Thread, Matter, Zigbee, and Bluetooth LE device designs.
Read more...Touch-enabled 32-bit MCU EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...Build smarter with UNO Q Electrocomp Express
DSP, Micros & Memory
The Arduino UNO Q’s hybrid design combines a Linux Debian-capable microprocessor with a real-time STM32U585 microcontroller making it the perfect dual-brain platform for the next innovation.
Read more...Enabling the next generation of high-performance wireless designs iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Espressif Systems has expanded its wireless connectivity portfolio with the introduction of the ESP32-E22, a high-performance connectivity co-processor designed for next generation embedded and IoT systems.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.