Fischer has released its 2004 product catalogue showing its three product groups. The design facilitates the easy finding and classification of each product. The three are: f.cool - for extruded heatsinks, heat conductive material and accessories; f.con - connectors, optoelectronic components etc.; f.case - 19" technology and cases.
Braid tail swept elbow backshells Electrocomp
Interconnection
TE Connectivity is complementing its series of banding (BT) and Tinel ring (TXR) backshells with a braid tail backshell. The new 70 Series swept elbow backshells include a pre-terminated screenbraid sock ...
Read more...Field-installable mini industrial I/O connector Electrocomp
Interconnection
The Industrial Mini I/O connector system made by TE Connectivity is a compact, wire-to-wire and wire-to-board solution for reliable serial, bus and Ethernet connections in industrial applications. At ...
Read more...New eBook draws on RF wireless design experts’ knowledge
Technical Literature
A collaboration between Mouser Electronics and Analog Devices has produced a new eBook highlighting the diverse challenges and solutions in RF wireless design. In ‘8 Experts on RF Wireless Design’, industry ...
Read more...Digital humidity sensor withstands harsh conditions Electrocomp
Analogue, Mixed Signal, LSI
Sensirion is expanding its series of fourth-generation humidity sensors to include the SHT4xI-Digital sensor platform, which has been designed specifically for challenging industrial applications. The ...
Read more...Digital flow sensor for respiratory devices Electrocomp
Analogue, Mixed Signal, LSI
The compact SFM3119 digital flow meter is the successor to Sensirion’s SFM3100 mass flow meter. Compared to its predecessor, the SFM3119 comes with a digital I2C output as well as improved specifications.
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Read more...Liquid flow sensor in small planar package Electrocomp
Analogue, Mixed Signal, LSI
With a tiny footprint of only 10 x 10 mm, Sensirion’s LPG10-1000 liquid flow sensor provides optimal performance and speed in measuring liquid flow in a planar microfluidic glass substrate, with down-mount ...
Read more...The state of 3D printing in 2021
Technical Literature
element14 has released a new eBook that offers insights into the history and the reality of 3D printing, including the processes, materials and applications – as well as what the future holds for this ...
Read more...Optional inner panels for IP68/66 plastic enclosures Electrocomp
Enclosures, Racks, Cabinets & Panel Products
Hammond Manufacturing’s 1557 family has proved to be very popular since it was launched some two years ago and is increasingly being used as a housing for electromechanical components as well as PCB-mounted ...
Read more...Very compact X2 capacitors Electrocomp
Passive Components
A recent introduction by TDK is a new series of very compact EPCOS X2 capacitors for noise suppression. They are rated for 275 V a.c. and cover a capacitance spectrum from 33 nF to 1 µF. Depending on ...
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