31 August 2022Manufacturing / Production Technology, Hardware & Services
Flip-Chip bonding technology has a long history, stemming from its inception by General Electric in (curiously) Indium Corporation’s hometown of Utica, New York. As such, the term 'flip-chip' has evolved to encompass a wide variety of bonding technologies which solve various bonding challenges. However, in the most basic sense of the term, flip-chip bonding defines the bonding process in which the circuitry of a chip is manufactured face-down and flipped to be attached to a substrate.
This webinar, hosted by Indium, will discuss the history of flip-chip technology, and the trends which have caused the manufacturing process to evolve will be discussed. Common failure modes in flip-chip assembly will also be touched on, as well as how material advancements have allowed for and will continue to push new technology in flip-chip bonding.
New handle for the XP Series joystick Brabek
Manufacturing / Production Technology, Hardware & Services
The new MF handle meets market demands to combine a traditional compact design with multiple functionalities and customisation options.
Read more...Next-level conformal coating Techmet
Manufacturing / Production Technology, Hardware & Services
The ASYMTEK Select Coat SL-1040 Series is Nordson Electronics Solutions’ most advanced conformal coating solution for high-volume production.
Read more...The impact of ML in robotics
Manufacturing / Production Technology, Hardware & Services
The integration of machine learning into robotics has the potential to revolutionise many industries, and particularly the manufacturing sector.
Read more...ITW EAE wins product introduction award Allan McKinnon & Associates
Manufacturing / Production Technology, Hardware & Services
ITW EAE has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines.
Read more...Revolutionising clean air in electronics manufacturing Allan McKinnon & Associates
Manufacturing / Production Technology, Hardware & Services
Designed to prioritise clean air in the electronics manufacturing industry, the ZeroSmog Shield Pro sets a new standard for workplace health and safety.
Read more...High-speed multi-function dispensing Techmet
Manufacturing / Production Technology, Hardware & Services
The D-VIS and DL-VIS from GKG SMT printer specialists are high-speed dispensing systems that can handle multiple scenarios.
Read more...Optical inspection for SMT Techmet
Manufacturing / Production Technology, Hardware & Services
The Xpection 1860 from Scienscope is a versatile X-ray inspection machine that offers comprehensive circuit board defect detection and quality assurance for the SMT industry.
Read more...Yamaha introduces upgrades to its 3D AOI systems Truth Electronic Manufacturing
Manufacturing / Production Technology, Hardware & Services
Yamaha Robotics SMT section has revealed performance-boosting upgrades for the YRi-V 3D AOI system, including faster board handling, multi-component alignment checking, and enhanced LED coplanarity measurement.
Read more...Flexible printed electronics substrates
Manufacturing / Production Technology, Hardware & Services
New LEXAN CXT film from SABIC offers high thermal process stability and transparency for demanding printed electronics substrates.
Read more...Lead-free solder paste Techmet
Manufacturing / Production Technology, Hardware & Services
Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloys.
printer friendly version