Passive Components


New high-CV hybrid capacitor

31 August 2022 Passive Components

NIC Components has released the NSPE-HC series of AEC-Q200 automotive-grade surface mount aluminium electrolytic capacitors. These capacitors feature high capacitance per case size and are offered in five case sizes from 6,3 x 6,3 mm to 10 x 12,8 mm (diameter x height). The series covers capacitance values from 56 to 560 µF in voltage ratings of 25V DC and 35 V DC. The components cover a wide operating temperature of -55 to 105°C and have a load life rating of 5000 hours at 105°C.

The excellent performance of the hybrid construction (polymer and liquid electrolyte) results in high ripple current ratings (up to 4 Arms/100 KHz), low ESR and high reliability. The NSPE-HC series is ideal for use in automotive, enterprise-level equipment and telecommunication/datacom (ICT) infrastructure equipment applications. Another advantage of the NSPE-HC series is a larger capacitance value per case size supporting smaller circuit designs, reduced part count and lower PCB costs.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Multi-config connector series
Future Electronics Interconnection
Hirose Electric’s DF11 Series is a versatile 2,0 mm pitch, double-row board-to-wire connector designed to simplify a wide range of connection needs.

Read more...
Wide frequency range inductors
RS South Africa Passive Components
TDK Corporation has expanded its ADL4524VL series (4,5 x 2,4 x 2,6 mm – L x W x H) of wire-wound inductors for automotive power-over-coax.

Read more...
New SiC power MOSFET
Future Electronics Power Electronics / Power Management
STMicroelectronics’ SCT012H90G3AG is a robust, automotive-grade SiC MOSFET, engineered for demanding power electronics, featuring a 900?V drain-source voltage and exceptionally low on-resistance of 12?mO at 60?A.

Read more...
Satellite IoT through non-terrestrial networks
Future Electronics Editor's Choice Telecoms, Datacoms, Wireless, IoT
Non-terrestrial networks fill cellular coverage gaps in remote areas by extending terrestrial networks and are not subject to disruptions from natural disasters or sabotage.

Read more...
1D Time-of-Flight sensor
Future Electronics Telecoms, Datacoms, Wireless, IoT
ams OSRAM has introduced its TMF8806, a 1D Time-of-Flight sensor that has been developed to remove the barriers of previous single-zone dToF devices.

Read more...
Easy installation panel mount assembly
Future Electronics Enclosures, Racks, Cabinets & Panel Products
NKK’s new easy installation Panel Mount Assembly (the BYB201-470) consists of a PCB, resistor, connector, and a straight PC adaptor.

Read more...
Microchip enhances digital signal controller lineup
Future Electronics DSP, Micros & Memory
Microchip Technology has added the dsPIC33AK512MPS512 and dsPIC33AK512MC510 Digital Signal Controller families to its dsPIC33A DSC product line.

Read more...
Cutting-edge hybrid capacitors
Avnet Silica Passive Components
Panasonic Industry recently announced the launch of the ZVU Series Hybrid Capacitors, a cutting-edge solution tailored to meet the escalating demands of advanced electronic systems.

Read more...
Low-profile tantalum chip capacitors
Electrocomp Passive Components
These general-purpose tantalum capacitors from Kyocera AVX are available in multiple case sizes with low profile options.

Read more...
PhotoMOS relays
Future Electronics Opto-Electronics
The AQY221R2SX and AQY221R2S PhotoMOS from Panasonic Industry ensures excellent characteristics and high-speed switching performance.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved