Industrial PCs are used in a large range of fields including automation, AI, IIoT, data acquisition and analysis, cloud, and edge computing. The demand for industrial PCs is currently high and, according to market research, is set to grow over the next few years.
Figure 1. ModBlox7 example layout.
Currently there is a huge number of manufacturers with equally different products in terms of performance, interfaces, market qualification, and mechanics. Many of these are proprietary to its own product family.
The ModBlox7 specification is set to change this by offering the advantages of modular systems with highly integrated box PCs. The increased demand for space-, size- and weight-optimised industrial PCs, combined with the lack of interoperability and flexibility of the current offering, formed the motivation for the ModBlox7 specification.
Figure 2. Standard and redundant architectures.
Based on a modular and flexible IPC system, every functional unit like the PSU, CPU, and I/Os can be combined in multiple ways to form an individual system. The system offers different mounting options like wall, DIN-Rail or 19-inch rack and comes with standard mechanical and electrical interconnection between functional units. For high availability solutions, redundant architectures can also be realised.
Benefits to having a modular approach are:
• Cost saving, as only units needed are purchased.
• Scalability at lowest space requirements.
• Interoperability between different manufacturers.
• Easy design of redundant architecture.
The ModBlox7 standard is expected to be released early in 2023.
4 mm pitch power connectors Spectrum Concepts
Interconnection
Mill-Max has introduced a new line of high-reliability, 4 mm (.157”) pitch sockets and headers designed for power connections and rugged field applications.
Read more...56 G MezzaWave connectors and cable assemblies
Interconnection
Engineered to deliver notable signal integrity, TE Connectivity’s high-speed, high-density 56 G MezzaWave connector family is built on an open-pin-field array platform that supports data rates up to 56 Gbps PAM4 for next-generation modular system
Read more...Space SMPM and SMPM-Lock connectors Hiconnex
Interconnection
Radiall has released the Space SMPM and SMPM-Lock, miniature Space connectors for high-frequency performance and high-density applications.
Read more...Compact, high density, heavy duty, thermoplastic connectors TRX Electronics
Interconnection
Amphenol Sine Systems ATD series connectors, available from Mouser, are a compact, high density, heavy duty, thermoplastic solution with superior environmental seals and end caps for exceptional rear seal retention.
Read more...Samtec supports SGeT oHFM.c with high-performance interconnects Spectrum Concepts
Interconnection
Samtec has announced a new product portfolio designed for the SGeT oHFM.c standard. These connectors are based on Samtec’s proven AcceleRate HD and AcceleRate HP high-density, high-performance product families.
Read more...Intelligent video processing Rugged Interconnect Technologies
Computer/Embedded Technology
The CHARM150AGX is based on a NVIDIA AGX Orin embedded processor, which incorporates a multicore ARM processor and powerful AI/ML accelerator.
Read more...Connectivity solutions for hydrogen technologies Hiconnex
Interconnection
As the production distribution and utilisation of hydrogen continue to scale, connectivity becomes a key enabler for efficient energy transmission, data communication, and system control.
Read more...Mixed-density Combo-D connectors Hiconnex
Interconnection
Positronic’s SCBM connector series is a rugged, high-performance family of mixed-density D-sub connectors engineered for demanding environments.
Read more...Same Sky expands rectangular connector portfolio Future Electronics
Interconnection
The portfolio includes male pin headers, female pin headers, and box headers, giving engineers the flexibility to select the most appropriate connector style for their specific design requirements.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version