ADLINK Technology has released the COM-HPC-cRLS module. Powered by the newest 13th Gen Intel processors up to Core i9 (24 cores and 32 threads), the board is a future-proof edge AI solution.
It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores), along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market for various AIoT deployments. The module provides support for up to 128 GB DDR5 memory with up to 4000 MT/s combined with increased cache, two 2,5 GbE LAN, and AI inferencing capabilities, making it ideal for on-edge AI use cases.
Equipped with Intel Time-Coordinated Computing (TCC) and Time Sensitive Networking (TSN) support, the COM-HPC-cRLS ensures timely execution of deterministic, real-time workloads with ultra-low latency, making it well suited for mission-critical AIoT applications, including industrial automation, AMR (Autonomous Mobile Robot), autonomous driving, medical imaging, and video broadcasting.
The board is also equipped with 4 USB 3.0, 8 USB 2.0, 2 SATA, 2 UART and 12 GPIO for connection to external peripheral equipment.
Microsoft Windows IoT on ARM Altron Arrow
Computer/Embedded Technology
This expansion means that the Windows IoT ecosystem can now harness the power of ARM processors, known for their energy efficiency and versatility.
Read more...Optimising AOI performance Rugged Interconnect Technologies
Manufacturing / Production Technology, Hardware & Services
Optimising AOI performance is now a reality with the highly integrated ADLINK MVP-6200, combined with Intel Arc GPUs.
Read more...Hardened-grade network switches CST Electronics
Computer/Embedded Technology
Lantronix’s hardened switches provide Layer 2 or Layer 3 networking, and are available as Power-over-Ethernet (PoE) or Power-over-Ethernet Plus (PoE+).
Read more...Ryzen V3000 computer on module Altron Arrow
Computer/Embedded Technology
SolidRun has recently announced the launch of its new Ryzen V3000 CX7 Com module, configurable with the eight-core/16-thread Ryzen Embedded V3C48 processor.
Read more...1.6T Ethernet IP solution to drive AI and hyperscale data centre chips
Computer/Embedded Technology
As artificial intelligence (AI) workloads continue to grow exponentially, and hyperscale data centres become the backbone of our digital infrastructure, the need for faster and more efficient communication technologies becomes imperative. 1.6T Ethernet will rapidly be replacing 400G and 800G Ethernet as the backbone of hyperscale data centres.
Read more...Maximising edge computing
Computer/Embedded Technology
Senao Networks has announced its launch of its SX904 SmartNIC based on the Intel NetSec Accelerator Reference Design.
Read more...UFS Ver. 4.0 embedded Flash memory devices EBV Electrolink
Computer/Embedded Technology
KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.
Read more...Edge-AI embedded computing Rugged Interconnect Technologies
News
The EMP-510 series from ADLINK is an 11th Gen Intel Core i5-based fanless computer. The system features an 11th Gen BGA SoC processor which is paired with up to 32 GB of DDR4 RAM. Up to four independent ...
printer friendly version