News


Power efficient mid-range FPGA

22 November 2023 News

The new imperatives of the intelligent edge – power efficiency, security and reliability – are forcing system architects and design engineers to find new solutions. For the growing number of system designers switching to PolarFire FPGAs and SoCs, Microchip announced new development resources and design services to aid the move. These include the industry’s first mid-range industrial edge stack, ready-to-customise cryptography and boot libraries, and new tools to convert existing FPGA designs to PolarFire devices. The additions expand Microchip FPGA’s comprehensive suite of tools and services supporting the PolarFire family of devices.

To back its FPGA-based embedded processor portfolio, Microchip offers broad RISC-V development support with more than 60 companies. The new resources that promise to offer immediate benefits at the design and development stage include:

• A comprehensive industrial edge stack for Open Platform Communications/Unified Architecture (OPC/UA)-based IIoT applications.

• Cryptography and boot soft IP libraries that can be fully customised. They join more than 200 proven, optimised, and easy-to-use processor soft cores and other Microchip FPGA IP elements, and more than

120 third-party cores. Each library element is optimised for the best area and timing with PolarFire FPGAs and SoCs for fast designs and prototypes.

• A high-performance AI/ML development flow that lets algorithm creators build their own mid-range FPGAs. This solution features SmartHLS compiler software, the VectorBlox accelerator software development kit (SDK) and neural-network IP.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.

Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.

Read more...
AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).

Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.

Read more...
Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.

Read more...
Siemens acquires Canopus AI
ASIC Design Services News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.

Read more...
Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.

Read more...
Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.

Read more...
AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.

Read more...
Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved