MediaTek releases its new flagship SoC

DSP, Micros & Memory

29 February 2024 DSP, Micros & Memory

Taiwanese semiconductor manufacturer MediaTek has released its new flagship SoC for mobile devices. The announcement of the Dimensity 9300 comes just weeks after Qualcomm announced its new SoC, the Snapdragon 8 Gen 3, with the hope that it will rival both Apple’s and Qualcomm’s latest offerings.

Unlike previous iterations of processors that use eight cores in a 1 + 4 + 3 design, the Dimensity 9300 foregoes this to include eight performance cores in a 4 + 4 design: four Cortex-X4 processors running at up to 3,25 GHz are combined with four Cortex-A720 processors that can run up to 2 GHz for less taxing tasks. Level 3 cache has also been expanded to 18 MB, 29% larger than the previous generation.

This provides a 15% single-core performance increase, and a larger 40% increase in multi-core performance. However, even with the increase in processing performance, the SoC produces a 33% power saving during multi-core usage.

The Dimensity 9300 is built on TSMC’s third generation 4 nm process, and is housed in a thermally-optimised package designed by MediaTek. The SoC is also the first to use LPDDR5T 9600 Mbps memory.

As with most newly released processors, the 9300 has also been given the generative AI treatment with 8x faster transformer-based generative AI performance and 2x faster integer and floating-point computing. This translates to executing AI models with up to 33 billion parameters, while being 45% more efficient.

The processor includes Arm’s latest flagship GPU architecture, the Immortalis-G720 GPU, which provides raytracing and 46% extra peak performance over the previous generation. This 12-core GPU can provide a raytracing experience at a smooth 60 fps.

Seamless 5G connectivity is provided with the R16 modem supporting Sub-6 GHz and mmWave transmissions. The first devices using this new chipset should be on the market by the end of 2023.

Share this article:

ICs vs modules: Understanding the technical trade-offs for IoT applications
NuVision Electronics Editor's Choice DSP, Micros & Memory
As the IoT continues to transform industries, design decisions around wireless connectivity components become increasingly complex with engineers often facing the dilemma of choosing between ICs and wireless modules for their IoT applications.

Read more...

Hardware quantum resistance to embedded controllers
Avnet Silica DSP, Micros & Memory
To help system architects meet evolving security demands, Microchip Technology has developed its MEC175xB embedded controllers with embedded immutable post-quantum cryptography support.

Read more...

High-performance processor for edge-AI
Altron Arrow DSP, Micros & Memory
The STM32MP23 microprocessor from STMicroelectronics is the latest addition to the STM32MP2 series, designed to meet the demands of industrial, IoT, and edge AI applications.

Read more...

PolarFire SoC FPGAs achieve AEC-Q100 qualification
ASIC Design Services DSP, Micros & Memory
Microchip Technology’s PolarFire SoC FPGAs have earned the Automotive Electronics Council AEC-Q100 qualification.

Read more...

Integrated STM32WBA6 wireless microcontrollers
Altron Arrow DSP, Micros & Memory
Cost-efficient and highly integrated embedded controllers for emerging 2,4 GHz wireless applications in smart home, health, factory, and agriculture.

Read more...

Ultra-low-power MCU with FPU Arm Cortex-M33
Altron Arrow DSP, Micros & Memory
STMicroelectronics has expanded its STM32 ultra-low-power family with the launch of the STM32U3 for cost-sensitive applications in industrial, medical, and consumer electronics devices.

Read more...

Low-jitter oscillators
DSP, Micros & Memory
The JOH21, JOE21 and JOD21 low-jitter oscillators with differential output are designed for applications that require accurate timing and precise synchronisation.

Read more...

Categories

DSP, Micros & Memory

MediaTek releases its new flagship SoC

Further reading:

Publications by Technews