In a recent white paper titled ‘Array Connectors for Mixed Signal Multi-Channel RFSoCs up to 8 GHz’, Samtec engineers described the research, development, simulation, and measurements performed in a project to design the optimal breakout region (BOR) for the use of array connectors that simultaneously carry analogue, digital, and power signals in an RF environment, as a replacement for traditional compression mount and threaded PCB connectors. The results showed that it is possible to route high-frequency, high-isolation RF signals and digital and power signals through a single connector.
System on Chip (SoC) implementations with integrated data converters, and RF front-end subsystems are being deployed in 5G/6G, phased array radar, SATCOM, FPGA cards, and test and measurement architectures. The use of these RFSoCs challenges the traditional approach of handling the RF signals with compression mount and threaded PCB connectors. A simple alternative, using multiple ganged connectors, still puts strain on form factor, weight, and financial budgets, especially as high-frequency RF channel counts increase in these SoC-based systems.
The first step of this research and development project was simple, as Samtec already had existing array connectors for high-performance, high-speed digital signalling. Adapting this technology for RF applications required the development of specific PCB stack ups and launch optimisations to achieve the differential crosstalk and return loss performance required for frequencies up to 8 GHz and beyond.
The design targets identified for this mixed-signal connector array project were based on the specifications from existing RFSoCs, such as the AMD Xilinx Zynq and included:
• 8 GHz bandwidth.
• 50 Ω system impedance for single-ended; 100 Ω for differential.
• Return loss of -12 dB up to 4 GHz, -10 dB up to 8 GHz.
• Crosstalk isolation between channels: -69 dBc to 4 GHz, -63 dBc to 8 GHz.
This work took an unconventional approach to an optimised breakout design in terms of materials, launch, connector pin field, and differential ground pattern. Because of that, a currently available 560-pin single array connector can support up to 26 differential RF signals.
Omniball through-hole contacts Spectrum Concepts
Interconnection
Mill-Max has introduced an expansion to its Omniball spring-loaded contact range with a new series of through-hole mount Omniball pins designed for robust and versatile interconnect solutions.
Read more...Phoenix’s Push-X range is growing Phoenix Contact
Interconnection
With the new XT 1,5 terminal blocks, Phoenix Contact is extending the series to include versions for conductor cross-sections from 0,34 to 2.5 mm2.
Read more...Connector range for demanding environments Future Electronics
Interconnection
TE Connectivity’s DEUTSCH connector range offers high-performance interconnect solutions engineered for demanding environments where reliability and durability are essential.
Read more...The mechanical side of power Spectrum Concepts
Interconnection
[Sponsored] Power delivery has always been a key requirement of electronic systems, but the way power is generated, distributed, and consumed is changing rapidly with renewable energy installations and energy storage systems introducing new power sources.
Read more...Magnetic connectors with 2,54 mm pitch Spectrum Concepts
Interconnection
This expansion of the company’s Maxnetic product line delivers next-generation high reliability magnetic connectors designed for use in ever shrinking electronic devices and their applications.
Read more...Reliable connectivity in harsh environments Future Electronics
Interconnection
The ecomate family of circular, multiway connectors from Amphenol delivers exceptional durability, safety, and versatility for power and signal applications.
Read more...Cylindrical interconnects with multiple configurations Startech Industrial
Interconnection
Part of the renowned 5015 family of cylindrical interconnects, 97 Series connectors from Amphenol offer an exceptional range of customisation options to meet diverse connectivity needs across multiple industries.
Read more...Trunk line fusion splicer
Interconnection
The JILONG 280T All-Rounder Middle Trunk Line fusion splicer is a rugged, high-performance fibre optic fusion tool engineered for core networks, FTTx, and access infrastructure.
Read more...Low profile spring-loaded connectors Spectrum Concepts
Interconnection
Mill-Max has announced the introduction of low-profile, surface mount additions to its 2 mm pitch spring-loaded connector range.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version