In a recent white paper titled ‘Array Connectors for Mixed Signal Multi-Channel RFSoCs up to 8 GHz, Samtec engineers described the research, development, simulation, and measurements performed in a project to design the optimal breakout region (BOR) for the use of array connectors that simultaneously carry analogue, digital, and power signals in an RF environment, as a replacement for traditional compression mount and threaded PCB connectors. The results showed that it is possible to route high-frequency, high-isolation RF signals and digital and power signals through a single connector.
System on Chip (SoC) implementations with integrated data converters, and RF front-end subsystems are being deployed in 5G/6G, phased array radar, SATCOM, FPGA cards, and test and measurement architectures. The use of these RFSoCs challenges the traditional approach of handling the RF signals with compression mount and threaded PCB connectors. A simple alternative, using multiple ganged connectors, still puts strain on form factor, weight, and financial budgets, especially as high-frequency RF channel counts increase in these SoC-based systems.
The first step of this research and development project was simple, as Samtec already had existing array connectors for high-performance, high-speed digital signalling. Adapting this technology for RF applications required the development of specific PCB stack ups and launch optimisations to achieve the differential crosstalk and return loss performance required for frequencies up to 8 GHz and beyond.
The design targets identified for this mixed-signal connector array project were based on the specifications from existing RFSoCs, such as the AMD Xilinx Zynq and included:
• 8 GHz bandwidth.
• 50 Ω system impedance for single-ended; 100 Ω for differential.
• Return loss of -12 dB up to 4 GHz, -10 dB up to 8 GHz.
• Crosstalk isolation between channels: -69 dBc to 4 GHz, -63 dBc to 8 GHz.
This work took an unconventional approach to an optimised breakout design in terms of materials, launch, connector pin field, and differential ground pattern. Because of that, a currently available 560-pin single array connector can support up to 26 differential RF signals.
What’s the big deal with open pin fields? Spectrum Concepts
Interconnection
The concept behind the open pin field array is that it provides many contacts that are not limited to a single role.
Read more...Halo mid-board optical transceiver Spectrum Concepts
Opto-Electronics
The Samtec Halo mid-board transceiver has been designed for next-generation embedded applications that require 56 and 112 Gbps PAM4 performance in low profile and ruggedised form factors.
Read more...Innovation in high-frequency cable design Spectrum Concepts
Telecoms, Datacoms, Wireless, IoT
[Sponsored] With frequencies approaching 110 GHz, a mismatch in impedance, an increase in insertion loss, or minute phase distortion can be the difference between success and failure.
Read more...New connector for Push-X technology Phoenix Contact
Interconnection
Phoenix Contact is extending the series of PCB connectors with innovative Push-X technology to include a new connector for conductor cross-sections up to 2,5 mm2.
Read more...Test cable designed for maximum ruggedness Conical Technologies
Interconnection
The Anoison PT test cable is designed for maximum ruggedness using a high-quality raw cable, connector, and smart armouring module.
Read more...Safe connection under load Phoenix Contact
Interconnection
The ArcZero DC connectors from Phoenix Contact can be safely connected and disconnected under load, providing operators with reliable protection against hazardous electric arcs.
Read more...Time-To-Market interconnect solutions
Interconnection
TTM Technologies are at the forefront of electrified powertrains, vehicle charging stations, and energy storage solutions, providing thermal management, high-current capabilities, and specialised solutions.
Read more...Connectors for energy storage systems Phoenix Contact
Interconnection
The new Phoenix Contact BPC series connectors are protected against polarity reversal making them ideally suited for use in energy storage systems.
printer friendly version