Technical Literature


Samtec Rugged Interconnect Design Guide

5 October 2005 Technical Literature

Samtec's rugged interface capabilities from I/O interfaces 'outside-the-box', to board level interconnects 'inside-the-box' are detailed in its new Design Guide: panel-to-panel and panel-to-board interfaces include IP68-sealed circular cable plugs and receptacles available in a variety of termination options; I/O cable plugs and receptacles for high speed and/or high density applications that require rugged features; a full line of standard I/O interfaces including modular jacks, D-subs, high speed serial interfaces, and RF plugs and sockets; a large variety of wire and connector options for board-to-board applications.

Arrow Altech Distribution, +27 (0)11 923 9600, [email protected]



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