AI is revolutionising electronics. As intelligent machines become essential, AI will be a cornerstone, aiding tasks from simple queries to complex creative endeavours. While AI’s potential is vast, developing it is complex. Partnering with an experienced collaborator can streamline development and minimise risks by navigating data, tools, software, and hardware complexities.
With that in mind, Avnet Silica has developed a new AI microsite where visitors can discover a plethora of AI/ML resources, including technical articles, webinars, and podcasts. The latest AI solutions and products are also available.
Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...SoC brings scalable edge AI to life Altron Arrow
AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
Read more...Wall-mount cooling for Edge IT
AI & ML
Designed to run 24/7 in critical compute environments, Vertiv CoolPhase Wall delivers up to 60% greater airflow than comfort cooling.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
Opto-Electronics Electronics Technology AI & ML
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...Edge AI improves condition monitoring EBV Electrolink
AI & ML
STMicroelectronics has introduced the IIS3DWB10IS, an intelligent MEMS vibration sensor designed for high-performance industrial condition monitoring applications.
Read more...Tiny SoM integrates NXP i.MX 91
AI & ML
The QS91 module from Direct Insight utilises the low-cost single core i.MX 91 to deliver secure, energy-efficient Linux capabilities for edge applications.
Read more...Robotics platform powers intelligent systems Vepac Electronics
AI & ML
The CEXD-INTRBL open robotics development system combines high-performance AI processing, sensor integration, and motion control into a compact embedded platform.
Read more...High-precision thick-film resistors Avnet Silica
Passive Components
The new Panasonic ERJPC high precision thick-film resistors series deliver accuracy levels previously only achievable with thin film technology, offering customers higher power density and cost-effective performance.
Read more...SensorGPT speeds intelligent IoT deployment
AI & ML
TDK has introduced SensorGPT, a new technology designed to accelerate the deployment of intelligent edge AI and smart IoT applications by dramatically reducing reliance on real-world sensor data.
Read more...Ideal entry point into edge AI Avnet Silica
AI & ML
congatec has released new COM Express modules with Intel Core Series 3 processors for cost- and energy-optimised embedded computing applications.
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