Siemens streamlines design of integrated 3D ICs
30 May 2025
Design Automation
Siemens Digital Industries Software recently introduced two new solutions to its Electronic Design Automation (EDA) portfolio that help semiconductor design teams address and overcome the complexity challenges associated with the design and manufacture of 2.5D and 3D integrated circuit designs.
Siemens’ new Innovator3D IC solution suite enables IC designers to efficiently author, simulate and manage heterogeneously integrated 2.5D/3D IC designs. In addition, Siemens’ new Calibre 3DStress software leverages advanced thermo-mechanical analysis to identify the electrical impact of stress at the transistor level. Together, these solutions dramatically reduce risk and enhance the design, yield and reliability of complex, next generation 2.5D/3D IC designs.
“By delivering a stress-aware multi-physics analysis solution powered by Calibre 3DStress and driven by the Innovator3D IC solution suite, Siemens enables customers to overcome the complexities and risks associated with 3D IC designs,” said Mike Ellow, CEO, Siemens EDA, Siemens Digital Industries Software. “These capabilities are critical for our customers, allowing them to accelerate productivity and meet stringent design timelines by effectively eliminating the barriers of design complexity that traditionally impact design cycles.”
Siemens’ new Innovator3D IC solution suite delivers a fast, predictable path for planning and heterogeneous integration, substrate/interposer implementation, interface protocol analysis compliance and data management of designs and design data IP.
Built on an AI-infused user experience offering extensive multithreading and multicore capabilities to achieve optimal capacity and performance on 5+ million pin designs, the new Innovator3D IC solution suite is comprised of the Innovator3D IC Integrator, a consolidated cockpit for constructing a digital twin using a unified data model for design planning, prototyping and predictive analysis; the Innovator3D IC Layout solution for correct-by-construction package interposer and substrate implementation; the Innovator3D IC Protocol Analyzer for chiplet-to-chiplet and die-to-die interface compliance analysis; and the Innovator3D IC Data Management solution, for the work-in-progress management of designs and design data IP.
For more information contact ASIC Design Services, +27 11 315 8316, [email protected], www.asic.co.za
Further reading:
Quad-Apollo MxFE reference design
Design Automation
The Quad-Apollo MxFE reference design exemplifies a complete, high-performance platform for every-element direct-RF sampling digital beamforming using Analog Devices’ Apollo mixed-signal front-end technology.
Read more...
MIKROE signs multi-year deal with Renesas
Dizzy Enterprises
Design Automation
MIKROE has signed a multi-year MCU development tool support deal with Renesas, which commits MIKROE to providing development tools for 500 of Renesas’ most popular MCUs.
Read more...
Future Electronics and SnapMagic announce CAD model integration to support faster design cycles
Future Electronics
Design Automation
Engineers can now download verified symbols, footprints, and 3D models directly from supported product pages, enabling a smoother transition from component selection to PCB layout.
Read more...
Pulsonix 14.0 advances design
Design Automation
Pulsonix’s latest PCB design software platform further strengthens simulation and brings significant enhancements in mechanical-electrical 3D integration, smarter comparison tools, and enhanced usability features.
Read more...
Silicon Labs’ Simplicity AI-enabled SDK
Design Automation
Silicon Labs recently unveiled a new way it is helping developers and their AI agents collaborate through its Simplicity AI SDK.
Read more...
Accelerate development of AI-enabled embedded systems
Design Automation
ADI’s CodeFusion Studio (CFS) is a modern embedded software development platform aimed at accelerating the creation of AI-enabled embedded systems.
Read more...
STM32CubeIDE for Visual Studio Code
Design Automation
STM32CubeIDE has moved from prerelease to official release marking a milestone in the deployment of STM32CubeIDE for Visual Studio Code.
Read more...
Siemens’ software selected for verification and validation
ASIC Design Services
Design Automation
Siemens Digital Industries Software recently announced that Veloce Strato CS and Veloce proFPGA CS have been deployed at Arm, a longtime user of Veloce, as part of its design flow for Arm Neoverse Compute Subsystems.
Read more...
Enhanced graphics on STM32U3
Design Automation
ST has introduced a new program designed specifically for users working with its mainstream STM32 MCUs, including STM32C0, U0, WBA, and U3 series.
Read more...
Semicon Summit 2025 - Dubai: Direct access to global chipmakers, built for Africa’s engineering needs
Design Automation
[Sponsored] The future of South Africa’s technology ecosystem depends on deeper integration with global supply chains and tighter alignment with semiconductor manufacturers. That alignment takes presence, interaction, and shared focus on real systems.
Read more...
printer friendly version