Manufacturing / Production Technology, Hardware & Services


An argument to redefine IPC class definitions for class 1, 2, & 3 electronics

31 October 2025 Manufacturing / Production Technology, Hardware & Services

In the world of electronics manufacturing, the IPC standards provide critical guidance on the design, manufacturing, and testing of circuit assemblies. These standards are categorised into three primary classes, Class 1, Class 2, and Class 3, based on the intended reliability and functionality of the end product [see table 1].

Class 1 covers products with the least stringent requirements, typically used for consumer electronics with short life spans and/or non-critical functions. Class 2 addresses products where performance and extended reliability are desirable but not mission critical. Class 3, the highest tier, applies to products requiring consistent, high performance in demanding or harsh environments, such as aerospace or medical devices.

While these classifications have served the industry well for decades, the landscape of electronics usage and expectations is changing. Even devices classified under IPC Class 1, historically considered lower quality with limited reliability requirements, are increasingly expected to perform in environments previously reserved for Class 2 or Class 3 products. This trend raises an important question: Should the IPC standards be redefined to reflect these evolving expectations, particularly regarding cleanliness and durability?

The increasing complexity of ‘low-end’ electronics

Consumer expectations for electronics have drastically changed. Devices once considered disposable are now integral to everyday life. For instance, smart home devices, wearable health trackers, and IoT gadgets often fall under Class 1 due to cost constraints and limited life span. However, these devices frequently operate in challenging environments, such as high humidity, temperature fluctuations, and exposure to contaminants. Despite being classified as Class 1, users expect these products to function reliably for extended periods.

Take the example of a fitness tracker worn during workouts and outdoor activities. While the IPC Class 1 designation may not mandate rigorous testing or cleaning standards, the product is exposed to sweat, dust, and moisture. Failure in such a device, while not catastrophic, can erode consumer trust and damage brand reputation. This demonstrates a gap in the current classification system: Class 1 electronics are not held to the same cleanliness or durability standards as Class 2 or 3 products, yet they are often expected to perform in similar environments.

The role of cleanliness in reliability

One of the most critical aspects of electronic assembly reliability is cleanliness. Contaminants left on a circuit board after the reflow process can lead to failures through mechanisms such as electrochemical migration (dendritic growth and parasitic electrical leakage) or corrosion. IPC Class 1 does not require stringent cleaning standards because these products are assumed to have lower reliability requirements. However, as we have seen, the environments in which these devices are deployed often demand higher cleanliness levels.

For example, a low-cost IoT sensor deployed in an industrial setting may be exposed to dust, chemicals, and humidity. If the assembly process does not include post-reflow cleaning, residues such as flux activators or ionic contaminants from board and component fabrication, assembly processes, and humans can compromise the device’s performance. While the IPC Class 1 designation may allow for these residues, the user expects the sensor to function reliably despite its lower classification.

Harsh environments and the need for redefinition

The traditional view of IPC Class 1 products as inherently disposable and of lower reliability is increasingly outdated. Modern electronics, regardless of classification, are often used in harsh environments. These environments expose devices to extreme temperatures, moisture, and contamination, all of which can lead to failure if appropriate manufacturing standards are not applied.

To read the full study visit www.dataweek.co.za/ex/aqueous2025.pdf


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.

Read more...
MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.

Read more...
Downstream demand, system reliability, and the expanding role of engineering-led distribution
Manufacturing / Production Technology, Hardware & Services
[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.

Read more...
The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.

Read more...
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.

Read more...
Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.

Read more...
Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.

Read more...
Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.

Read more...
The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.

Read more...
Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved