Technical Literature


Signal Integrity Interconnect Design Guide

23 August 2006 Technical Literature

Samtec's ability to provide 'signal integrity at any distance' is detailed in its new Interconnect Design and Signal Integrity Services Guide. It includes end-to-end solutions for panel-to-panel, panel-to-board, cable-to-board and board-to-board applications as well as signal integrity design resources including PCB design tools. Also, a variety of high speed high density connectors for achieving interconnects from 3 mm to 3 metres. Single-ended and differential pair connectors, elevated board stackers, right-angle and card-edge systems for perpendicular and co-planar board mating, controlled impedance flex circuits, and high data rate cable systems are available.





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