Würth Elektronik has launched a comprehensive heat sink portfolio, divided into three specialised product groups. The WE-HTO heat sinks are designed for THT-TO packages like the TO-220 and TO-247. WE-HIC includes classic finned heat sinks for components with flat surfaces, such as CPUs or DC/DC converters. The WE-HTOI and WE-HICI variants are supplied from the factory pre-coated with thermal interface material. This eliminates the air gap between the component and the heat sink, thus maximising cooling performance. As a special service, Würth Elektronik provides technical support, detailed heat-sink characteristics, simulation options, as well as customer-specific modifications.
The WE-HTO heat sinks are available in various shapes and with different surface structures to enable tailored cooling performance. These include variants with curved sheet metal and with cooling fins, which dissipate more heat through their increased surface area. In addition, matching M3 screws, nuts, and insulating sleeves for mounting on the WE-HTO and WE-HTOI heat sinks can also be ordered.
WE-HIC is available in two variants; with continuous or interrupted fins. The design with continuous fins is designed for applications in which the airflow is aligned with the fins. The variant with interrupted fins, however, is ideal when airflow in the installation environment cannot be clearly defined. Heat sinks for ICs are available in sizes ranging from 20 × 20 to 40 × 40 mm.
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