Accurate solder paste inspection with unprecedented simplicity
31 July 2026Manufacturing / Production Technology, Hardware & Services
The PI series 3D SPI from Mycronic, measures paste volume with extreme precision and gives highly accurate SPI data, combined with a range of smart auto-programming functions that ensure high-quality inspection regardless of operator experience.
The series handles jet-printed PCBs with the same inspection performances and programming process as for screen-printed boards. The synergy with Mycronic MY700 Jet Printer enables the inspection of all types of deposit shapes and volumes, regardless of the type and viscosity of the jetted paste. It accurately calculates the expected volume of paste and instead of evaluating the volume based on the Gerber stencil data, it uses data transmitted from the jet printer. It then communicates any defects resulting from insufficient paste to the printer, along with the ID code of the concerned PCB. A second run in the jet-printer corrects the defect without having to wash and reprint the entire board.
It requires only a single bare board scan to accurately program itself. No fine tuning and no manual calibration. Its patented Z-referencing technology captures hundreds of references across an ultra-large 3D field of view, giving unprecedented accuracy for even the smallest paste volume measurements.
PI’s automatic pad grouping by AAR (Area Aperture Ratio) allows for the setting of tolerances independently of products. Together with the MYPro Link software suite, the inspection data can be transformed into actionable process information.
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