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Indium wins awards on two continents

11 June 2008 News

Indium's Indium8.9 lead-free no-clean solder paste was honoured twice in two weeks with leading electronics assembly awards. It earned the Vision award at the Apex convention in Las Vegas, and just one week later, garnered the China Vision award at Nepcon China in Shanghai. Sponsored by SMT-Magazine and SMT China Magazine, these awards honoured products and technologies that have shaped the PCB manufacturing industry over the past year.

Indium8.9 is a third-generation solder paste which brings together the reliability of a Sn/Pb paste with RoHS compliance. It exhibits outstanding print-transfer properties, especially with CSP, 0201 and 01005 components, with consistent print volumes through apertures below the industry recommended minimum area ratio of 0,66. A robust reflow process window can accommodate high peak temperatures and long soak profiles.

Indium8.9 eliminates 'head-in-pillow' defects when mounting BGA devices. Its excellent wetting improves first-pass yields and reduces field failures. In addition, it provides excellent test probeability and is thermally stable, offering soft, pliable post-reflow residues resulting in fewer false rejects during in-circuit testing.





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