News


Altera's FPGA wins DesignVision award

6 August 2008 News

Altera’s Stratix III FPGAs were presented with the International Engineering Consortium’s (IEC) DesignVision Award in the Semiconductor and IC category. Stratix III FPGAs were recognised by the IEC for their unique and innovative architecture, which enables Altera to deliver some of the industry’s highest performance and lowest power high-end FPGAs.

The devices were also recognised for their DDR3 memory interface, which offers memory performance speeds in excess of 1067 Mbps.

Started in 2005, the IEC's DesignVision Award recognises technologies, applications, products and services judged to be the most unique and beneficial to the industry. DesignVision Award candidates are judged based on innovation, uniqueness, market impact, customer benefits and value to society.

A key architectural innovation of Stratix III FPGAs is their power reduction capability, which includes Programmable Power Technology and Selectable Core Voltage. With these innovations, Altera is able to lower the devices' total power consumption by up to 50%, when compared to previous-generation high-end FPGAs.

For more information contact EBV Electrolink, +27 (0)21 402 1940, capetown@ebv.com, www.ebv.com



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Industrial time-of-flight proximity sensor
EBV Electrolink Opto-Electronics
STMicroelectronics’ VL53L4ED is a compact, high accuracy time-of-flight proximity sensor designed for industrial and embedded applications that require precise short range distance measurement.

Read more...
Ultra-low-power smart metering
EBV Electrolink Analogue, Mixed Signal, LSI
ScioSense’s UFC23 sensor combines improved resolution and offset stability with ultra-low standby current, enabling high-end battery-powered water, heat, gas and leak detection meter designs.

Read more...
From the editor's desk: Pricing surge reshapes engineering reality
Technews Publishing News
The recent and continuing surge in memory prices has become more than a supply-chain story confined to global semiconductor markets. We have watched in disbelief as the ASP of memory has risen by over ...

Read more...
Siemens democratises EDA software access
News
This collaboration will provide streamlined access to advanced electronic design automation software for European semiconductor innovation.

Read more...
Components distribution: A promising trend
News
The European electronic components market returned to solid growth in Q1, gaining 16,9%, with broad, but uneven, momentum across the region.

Read more...
New appointment for Links Field team
Links Field Networks News
Links Field Networks is excited to welcome Jarrod Hutton to the company as a technical sales representative, bringing a powerful combination of technical expertise, creativity, and a genuine passion for innovation.

Read more...
Solar skills empower Alexandra youth
News
To support developing renewable energy skills, Yellow Door Energy launched YDE Lumen30, a programme that trained 30 young people from Alexandra township in Johannesburg.

Read more...
Advancing hydrogen mobility in South Africa
News
The hydrogen refueller was developed using South African engineering expertise and complies with 42 international and local standards.

Read more...
High-performance SSD storage
EBV Electrolink Telecoms, Datacoms, Wireless, IoT
Targeting the performance segment, the new KIOXIA XG10 Series leverages PCIe 5.0 technology to significantly elevate speed and responsiveness across data-intensive client applications.

Read more...
Next-gen robotic systems initiative
EBV Electrolink Design Automation
EBV Elektronik recently introduced MOVE – Driving Robotics Forward, a new initiative designed by EBV Elektronik‘s Embedded Solutions team to support the development of next-generation robotic systems.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved