Cobar solder paste wins technology award
12 November 2008
Cobar won a global technology award in the flux materials category for its XF3 lead-free solder paste, developed to accommodate extended reflow profiles with or without the use of nitrogen. XF3 completes the family of Cobar products based on Nihon Superior’s patented SN100C-alloy.
The award was presented by Global SMT & Packaging Magazine’s publisher and editor-in-chief Trevor Galbraith during an awards ceremony that took place during the SMTA International exhibition and conference in Florida in the USA.
XF3 demonstrates excellent wetting performance on all common metal surfaces. It exhibits a robust printing window for printing at 10 to 200 mm per second. It is classified as an IPC-JSTD 004 REL0 solder paste with safe residues that keep reflow ovens clean.
XF3 comes with different solder alloys:
* SnPb for products that are still RoHS exempt.
* SAC alloys for mainstream lead-free products.
* SN100C lead-free alternative with excellent solder and reliability properties.
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