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Electronics Manufacturing & Production Handbook 2019


YESTech ships 1000th inspection system
5 August 2009, News

YESTech has announced the sale of its 1000th system to Teledyne Electronic Manufacturing Services (EMS) in the USA, a full service electronic contract manufacturing supplier.

Teledyne EMS, providing electronic assemblies that meet the outsourcing needs for the defence and commercial communities, first purchased a YESTech YTV F1 AOI system after evaluating several different systems. The primary role for the AOI systems at Teledyne EMS is to provide immediate, consistent feedback for defect reduction and to facilitate more complete visual inspection processes, improving capture abilities.

In recent months, Teledyne EMS has been experiencing an increasing volume of new product introductions. Products are of increasing complexity, utilising smaller components, with higher placement densities. In addition, the projects have been demanding shorter development cycles with limited prototype runs. YESTech’s F1 AOI facilitates improvement in capture rate of build defects, while the B3 benchtop is utilised to enhance the final visual inspection process. This has proven to add value, consistency and effectiveness to the quality inspection process.

Other factors also played a role in Teledyne EMS’ decision to purchase YESTech systems, including advanced lighting and intuitive software. “The LED lighting is much better, in that we have experienced fewer false failures than in the existing AOI equipment on the factory floor,” said Don Cook, manager, Manufacturing Engineering. “In addition to the lighting, the ease of programming and highly flexible software has been a major benefit to our organisation. The software platform is very intuitive, allowing quicker turnaround times for new product introductions, as well as making the training process much simpler and shorter, reducing labour costs,” he adds.

For X-ray inspection, YESTech’s patented X3 3D automated X-ray inspection system (AXI) provides fast and complete inspection of double sided PCBs with BGAs and other critical solder joints.

The F1 series AOI, with Thin Camera technology, and Fusion Lighting, offers high-speed PCB inspection with enhanced defect coverage and a very low false failure rate. The system utilises a standard package library to simplify training and ensure program portability across manufacturing lines. Configurable for all line positions, the machine is equally effective for paste, pre-/post-reflow or final assembly inspection. Off-line programming maximises machine utilisation and real-time SPC monitoring provides a valuable yield enhancement solution.

Supplied By: Test & Rework Solutions
Tel: +11 704 6677
Fax: 088 011 704 5372
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