Technical Literature


Micro Backplane Interface Design Guide

19 August 2009 Technical Literature

This new design guide from Samtec details how the company's high-speed and high-density board-to-board and panel-and-I/O interface solutions can be used for add-on boards, creative packaging solutions and for increasing I/O density. Creative I/O solutions are shown that can increase panel density and/or achieve I/O flexibility. Coax cable and high-speed flex jumper solutions can route signals from the back of the box to the front panel, and can also be used to bypass traditional backplanes.



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