Advantages of solder paste in assembling package-on-package boards
9 November 2011News
Manufacturing / Production Technology, Hardware & Services
Multimedia, Videos
Dataweek has partnered with the UK's National Physical Laboratory (NPL) to feature instructional videos on various defects encountered in the manufacturing of electronic printed circuit boards.
Industry expert Bob Willis uses the NPL Defect Database to explain the advantages of dipped solder paste in assembling PoP boards.
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In modern SMT lines, stencil printing must meet two requirements at the same time: it has to ensure a reproducible solder paste volume, while adhering to the specified line cycle time.
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