Webinar: Bob Willis
25 November 2019
Events
When: 2 December 2019 from 2:30 to 4:00 pm (UK time).
Duration: Between 60 and 90 minutes, including question and answer session.
Cost: £65
Register: www.dataweek.co.za/*nov19-bobwillis
New components often provide challenges to design, process and quality engineers. Solder joint failure, voiding plus contamination and corrosion are just a few of the problems experienced so far. Any large-area component with a low stand-off which needs to be reflow soldered to a substrate can be a challenge, but at ever decreasing pitch the need for good process validation and correct design is vital for high yields.
Key topics presented by Bob Willis in his webinar ‘QFN/LGA Design, Assembly Process Issues & Reliability Failures’ will include: design options to reduce failures; process improvements in design and assembly; void reduction; improvements in joint reliability; simple 5-minute solderability assessment; improved cleaning performance; results in cleaning and SIR on QFN packages; process results from vapour phase and convection reflow; solder joint reliability; IPC design and process guidelines.
Provided free with this webinar are Bob Willis QFN inspection and quality control wall charts to use in your own manufacturing and training facility.
http://www.bobwillis.co.uk
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