Indium8.9HFRV is an air reflow, no-clean solder formulated to improve the voiding performance of next-generation Pb-free high reliability alloys.
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The NPM G Series of Panasonic’s surface mounted technology production systems is designed to respond in real-time to customer supply and demand changes.
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Panasonic’s AM100 modular placement machine offers a one-machine solution and provides flexibility and reliability in a cost-effective way.
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The high precision new-model 3Xi-M200 V2 from Saki Corporation features improved inspection ability, higher speed, and low maintenance.
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PicoShot WS-5M is designed for customers needing an SnPb solder paste for their Mycronic MY-series jet printers.
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Indium Corporation has added a cleanable and halogen-free solder paste to its portfolio which combines non-wet open (NWO) performance with excellent stencil print transfer efficiency.
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The new modular placement system mixes a wide variety of machine layouts together with a range of options to offer an optimum line suitable for all types of production.
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1 Click SMT Technology Company’s Unit-i1 is a compact inline selective soldering machine that combines a drop jet fluxer nozzle, bottom IR preheater, selective solder pot, and automated optical inspection (AOI) function.
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JTU’s second-generation reflow oven is hands-free and fully automatic, and is equipped with automation features such as automatic recipe switching using barcodes, and automatic conveyor width adjustment according to recipe.
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Saki Corporation has developed the new 3Di series of high-speed, high-precision, next-generation in-line 3D automated optical inspection (3D AOI) systems for complex inspection of high-density printed circuit boards.
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Indium Corporation has earned the Circuits Assembly New Product Introduction (NPI) Award for its flux-cored wire, CW-818.
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Indium has earned a BISinfotech BETA award as global leader in the solder and materials category, making it the third consecutive year Indium has received a BETA award.
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