Otto Wireless Solutions is proud to announce the promotion of Miyelani Kubayi to the position of technical director, effective 1 August 2025.
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The WisNode Bridge series by RAKWireless is designed to convert traditional wired industrial protocols like RS485 and Modbus into LoRa-compatible signals.
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The A7673X LTE Cat 1bis module from SimCom is engineered to meet the growing demands of the IoT industry, offering exceptional performance and seamless integration.
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The innovative LTE modules A7683E, A7663E, and A7673X have revolutionised IoT connectivity and saved costs for developers and circuit manufacturers.
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Reliable connectivity is essential in today’s world - whether you’re working from home, running a small business, or living in a rural area where mobile signals are weak.
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SIMCom recently announced that its range of Cat 1 bis IoT modules are now being prepared with the firmware necessary to support SGP.32 functionality.
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SIMCom’s A7673X series is a Cat 1 bis module that supports LTE-FDD, with a maximum downlink rate of 10 Mbps and an uplink rate of 5 Mbps.
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What is likely to happen during the sunset period for 2G and 3G signals, especially on the back of already near-obsolescence of 2G network equipment, is for the availability of the connectivity mediums to begin to reduce between now and the shutdown date.
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SIMCom’s new SIM7070G-HP-S module supports 3GPP Rel-17 at L-band (B255) and S-band (B23/ B256) frequencies, enabling IoT systems to be deployed in regions where terrestrial networks are unavailable.
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Links Field Network’s focus is international roaming data, and by leveraging their holding company’s international footprint and pricing structure, Links Field Networks South Africa works closely with their local shareholder to offer fully connected devices, regardless of where it is to be used globally.
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Otto Wireless Solutions announced that their technical manager, Miyelani Kubayi, has won the SIMCom Wireless Solutions Golden FAE Award for 2023.
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SIMcom has catered for this uncertainty by providing multiple devices, whilst maintaining footprint and pin compatibility across the product range, despite the newer devices becoming more streamlined towards IoT applications.
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