The RZ/G3E from Renesas is a microprocessor integrated with quad CPU and NPU in one chip, improving power efficiency, reliability, and security.
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This is a new, RTOS-independent software solution for Bluetooth LE development, designed to ease developers’ migration from the legacy nRF5 SDK and nRF52 series to the next-generation nRF54L series.
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The latest Bluetooth module from Panasonic Industry provides excellent performance and minimal power consumption.
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As reliance on renewable sources like wind and solar continues to grow, the need for efficient energy flow and storage solutions has become more critical than ever.
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The FRDM-MCXC444 is a compact and scalable development board for rapid prototyping of MCX C444 MCU from NXP Semiconductors.
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Panasonic Industry recently announced the launch of the ZVU Series Hybrid Capacitors, a cutting-edge solution tailored to meet the escalating demands of advanced electronic systems.
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To help system architects meet evolving security demands, Microchip Technology has developed its MEC175xB embedded controllers with embedded immutable post-quantum cryptography support.
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Avnet Silica has named Hydronauten winner of the Advanced Electronics Challenge for breakthrough AI-driven vibration damping technology.
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Following the company’s popular PAN1780, the PAN1783 Bluetooth 5.3 Low Energy (LE) module from Panasonic is based on the Nordic nRF5340 single chip controller.
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NXP’s IW610 wireless chip solution features a 1x1 dual-band Wi-Fi 6 radio subsystem, offering improved network efficiency, reduced latency and extended range.
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Microchip Technology is leveraging the power of artificial intelligence (AI) to assist software developers and embedded engineers in writing and debugging code with the launch of its MPLAB AI Coding Assistant.
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Microchip’s SAMA7D65 MPU runs a 1 GHz Arm Cortex-A7 core and integrates MIPI DSI, LVDS display interfaces and 2D GPU for HMI applications.
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