Avnet Silica

Tel: +27 11 319 8600
Email: [email protected]
www: www.avnet.com/wps/portal/silica
more information about Avnet Silica

Cloud platform to securely manage and connect edge devices
26 February 2021, Telecoms, Datacoms, Wireless, IoT

Brand new from NXP Semiconductors is its EdgeLock 2GO IoT service platform for easy, secure deployment and management of IoT devices and services. The new IoT security platform is integrated with NXP’s ...
read more


MCUs with advanced analog peripherals
25 November 2020, DSP, Micros & Memory

Microchip Technology’s new PIC18-Q41 and AVR DB microcontroller (MCU) families are the first to combine advanced analog peripherals and multi-voltage operation with inter-peripheral connections for increased ...
read more


Cloud connectivity for all Microchip MCUs and MPUs
25 November 2020, Telecoms, Datacoms, Wireless, IoT

From the smallest PIC and AVR microcontrollers (MCUs) for sensors and actuator devices, to the most sophisticated 32-bit MCU and microprocessor (MPU) gateway solutions for edge computing, Microchip Technology ...
read more


IoT innovation award for Digi XBee Tools
25 November 2020, Telecoms, Datacoms, Wireless, IoT

Digi International was named a winner of Connected World’s 2020 IoT Innovations Awards for its Digi XBee Tools. The IoT Innovations Award programme recognises out-of-the-box, transformative IoT products, ...
read more





<< First   < Previous   Page 8 of 8     







While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved