EBV Electrolink

Tel: +27 11 236 1900
Email: [email protected]
www: www.ebv.com
more information about EBV Electrolink

Reflective optical IR sensor
31 August 2022, EBV Electrolink, Opto-Electronics

The VCNT2025X01 is a miniature SMD reflective optical infrared sensor, from Vishay Semiconductors, with a daylight blocking filter built in.
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EBV Elektronik wins top award
31 August 2022, EBV Electrolink, News

EBV Electrolink, a franchised distribution partner of STMicroelectronics, has been recognised by ST as the 2021 best performing distributor in EMEA.
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Microchip expands its MPU-based SOM portfolio
31 August 2022, EBV Electrolink, DSP, Micros & Memory

The SAM9X60D1G-SOM is the newest addition to the existing portfolio of MPU-based SOMs built using a common set of Microchip components to reduce design complexity and overall PCB costs.
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Advantages of Wi-Fi 6 for the IoT
31 August 2022, EBV Electrolink, Editor's Choice, Telecoms, Datacoms, Wireless, IoT

From the IoT perspective, Wi-Fi developers have recognised that faster is not always the best choice. In generations prior to Wi-Fi 6, increased raw throughput was the primary objective. Now, the trade-offs between some KPIs allow system designers the flexibility to focus on the aspects important in their design.
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Reflective optical infrared sensor
27 July 2022, EBV Electrolink, Opto-Electronics

The VCNT2025X01 is a miniature SMD reflective optical sensor from Vishay Semiconductors with a daylight blocking filter built in.
read more


FlightSense multi-zone ToF sensor
27 July 2022, EBV Electrolink, DSP, Micros & Memory

STMicroelectronics has revealed FlightSense multi-zone ToF sensor for gesture recognition, intruder alert, and human presence detection to be used in front of PCs. The cost-effective non-vision-based turnkey solution detects user presence, recognises gestures, and protects against ‘shoulder surfers’ for smoother interactions, enhanced security, and power saving.
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Samsung begins chip production using 3 nm process technology
27 July 2022, EBV Electrolink, Electronics Technology

The optimised 3 nm process with GAA architecture achieves 45% lower power usage, 23% improved performance and 16% smaller surface area compared to 5 nm process.
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Samsung unveils new image sensor with industry’s smallest pixel size
27 July 2022, EBV Electrolink, News

The ISOCELL sensor, with a pixel size of 0,56 µm, enables more accurate and quicker auto-focusing and can reduce the module area by 20%.
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Lowering the cost of solar PV inverters
27 July 2022, EBV Electrolink, Passive Components

Vishay has turned its attention to lowering the cost of solar PV inverters and by reducing the number of electrolytic capacitors required.
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AMD Xilinx online training: Vivaldo ML tools
27 July 2022, EBV Electrolink, Computer/Embedded Technology

The webinar will explore the features of SystemVerilog that are useful for RTL synthesis using Vivado ML Tools and how the RTL SystemVerilog language constructs have been optimised for productivity and reliability.
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New high current through-hole inductors
27 July 2022, EBV Electrolink, Passive Components

Vishay has released a high current, through-hole inductor for use in high current and high temperature applications, DC/DC converters, high current differential chokes and inverters.
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Samsung launches GDDR6 RAM module
27 July 2022, EBV Electrolink, Computer/Embedded Technology

The DRAM is capable of 24 Gbps processing speeds and will significantly advance the graphics performance of AI-based applications and high-performance computing.
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