GCT has expanded its range of Flat Flex products with the new FFC3A20, which is engineered for best value while offering premium performance.
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Vishay has released its new surface-mount multilayer ceramic chip capacitors, which are available in custom frequency ranges.
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Vishay’s new 4th generation EF series power MOSFET technology currently offers the industry’s lowest on-resistance of only 0,045&nsp;O at 25°C when compared to similar devices.
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Kyocera AVX has introduced a series of pouch-style supercapacitors for decreasing current surges in batteries.
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The FEV300 Electric Vehicle Charging Station Adapter is designed to simulate an electric vehicle attached to the EVCS. The tool allows for the output voltage of an AC charging station Mode 3 with connector types 1 and 2 to be safely and accurately tested in accordance with IEC specifications.
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TDK has announced a new DSP-controlled power supply unit (PSU) that is only 1U in size for rack mounting but has an output of 7,5 kW.
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TE’s aluminium nitride thin film power resistor type 3503 and 3504 series range offers high power to size ratio, with a power rating of 2 W in 1206 size (3503 series) and 6 W in 2512 size (3504 series).
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With a flat connector housing design, they can fit through any 20 mm hole, making them ideal for use in sensor interface applications in industrial and commercial vehicles.
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Designed for multi-phase, high-current power supplies and input filters in automotive applications, the new high-temperature inductor offers a 50% reduction in DCR over typical power inductors.
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The MC-1010-18Q is a high-performance GNSS positioning module from LOCOSYS that can support the new GPS L1C and BEIDOU B1C signals.
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Powered by the Qualcomm QCS8250 SoC, Fibocom’s high-performance AI smart module SCA825-W offers a computing power of up to 15 TOPS and powerful multimedia functions, empowering compute-intensive AIoT applications.
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Once a UWB-enabled device like a smartphone, smartwatch, smart key or tile is near another UWB device, the devices start ‘ranging’. Ranging refers to calculating the time of flight (ToF) between devices: the roundtrip time of challenge/response packets.
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