Electrocomp

Tel: +27 11 458 9000
Email: [email protected]
www: www.electrocomp.co.za
more information about Electrocomp

Touch screen controller
23 April 2014, Electrocomp, Analogue, Mixed Signal, LSI

FTDI Chip has expanded its Embedded Video Engine (EVE) offering with the introduction of the FT801, which supports intelligent display implementations with capacitive touch screens. The new device possesses ...
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Connector for thin LED lighting modules
23 April 2014, Electrocomp, Interconnection

Molex announces its new Lite-Trap SMT wire-to-board connector system featuring an overall compact size that meets the needs of thin LED lighting module applications. With a profile height of just 4,20 ...
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Chip-on-board LED holders
2 April 2014, Electrocomp, Interconnection

Molex produces a range of solderless chip-on-board (COB) LED holder solutions for mounting COB LED arrays into luminaires. These holders make it very easy to integrate LEDs into a lighting fixture without ...
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Micro USB 2.0 connector
12 March 2014, Electrocomp, Interconnection

As consumer products are getting thinner and smaller, they are becoming increasingly vulnerable to water and dust. Being able to support electronic devices with splash-proof and dust-proof components ...
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Bluetooth Smart module
12 March 2014, Electrocomp, Telecoms, Datacoms, Wireless, IoT

TDK has produced an ultra compact Bluetooth low energy module designed for the Bluetooth 4.0 low energy (LE) specification, which is being marketed as Bluetooth Smart. With its footprint of just 4,6 x ...
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High-speed backplane connectors
19 February 2014, Electrocomp, Interconnection

TE Connectivity’s new Impact backplane connector system is designed for increased speed and density to meet the future system upgrades and next-generation requirements of data networking and telecommunications ...
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New solder paste and wire from Balver Zinn
29 January 2014, Electrocomp, Manufacturing / Production Technology, Hardware & Services

The Balver Zinn Group débuted a new solder paste and wire at productronica in November.    OT2 is Cobar’s latest halide- and halogen-free solder paste technology whose optimised rosin-based chemistry ...
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Ceramic transient voltage suppressors
29 January 2014, Electrocomp, Circuit & System Protection

The Epcos range of ceramic transient voltage suppressors from TDK are voltage-dependent resistors with symmetrical V/I characteristic. Their resistance value decreases with increasing voltage, effectively ...
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High-sensitivity GPS module
29 January 2014, Electrocomp, Telecoms, Datacoms, Wireless, IoT

The Locosys MC-1108 GPS module, powered by MediaTek, provides high sensitivity and performance even in urban canyon and dense foliage environments. It supports hybrid ephemeris prediction to achieve ...
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Embedded graphic controller
13 November 2013, Electrocomp, MB Silicon Systems, News

FTDI Chip ventured into a new application sector beyond the USB semiconductor and software solutions it is best known for. Addressing the need for ever more advanced forms of human-machine interaction, ...
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Low-voltage power connector
13 November 2013, Electrocomp, Interconnection

TE Connectivity announced the release of the Pivot Power RJ45 connector, a low-voltage power connector that commons RJ45 contacts to provide two power connections through an industry standard RJ45 interface. ...
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Noise suppressing chip beads
23 October 2013, Electrocomp, Circuit & System Protection

TDK has extended its MMZ portfolio of Gigaspira beads with the MMZ1005-V series, which reportedly features the world’s highest impedance peak frequency in the 2,5 GHz range. The EMC components enable ...
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