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The CMD279C3, made by Custom MMIC, is a positive controlled, wideband GaAs MMIC 5-bit digital attenuator that operates from 2 to 18 GHz (S, C, X, Ku band).
Each bit of the attenuator is controlled by
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The QPQ1907 from Qorvo is a 2,4 GHz Wi-Fi/BT/LTE co-existence BAW band-pass filter. It has extremely steep skirts, simultaneously exhibiting low loss in the Wi-Fi band and high rejection near and in the
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The AMM-6702UC is a connectorised millimetre-wave amplifier with an ultra-wide 20 to 55 GHz bandwidth, over 25 dB gain, and up to +23 dBm saturated output power with only a 0 dBm input.
Made by Marki
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Pasternack has introduced a new line of solderless vertical launch connectors that are ideal for high-speed networking, high-speed computing and telecommunications applications. The series consists of
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Qorvo introduced a new system in package (SiP) that enables dynamic, simultaneous support for Zigbee 3.0, Green Power, Thread and Bluetooth Low Energy (BLE).
It integrates Qorvo power amplifier technology
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Taoglas has launched three NB-IoT antennas, including a compact ceramic NB-IoT antenna and an ultra-thin, flexible multiband antenna that supports all LTE bands.
The low-profile, highly efficient NCP.5820
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Nordic Semiconductor’s nRF52840 multiprotocol system-on-chip (SoC) can now be used to build and ship commercial Zigbee designs. This means Nordic customers can now build and ship commercial Zigbee products
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The MM1-0832L/H double-balanced GaAs MMIC mixer from Marki Microwave is a suitable solution for X through Ka bands, with full coverage for traditional satcom uplink and downlink applications. RF/LO frequency
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Available from Tibbo is a trio of compact and affordable serial controllers which are programmable in Tibbo BASIC and Tibbo C. Features include Wi-Fi, PoE (Power over Ethernet), display, RS-232, RS-485,
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Coaxial cable is the most commonly used transmission line for RF and microwave applications, because it provides reliable transmission with the benefits of wide bandwidth, low loss and high isolation.
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The S76S LoRa wireless communication module, designed and manufactured by AcSiP Technology, is a system-in-package (SiP) housed in a 13 x 11 x 1,1 mm LGA form factor.
Powered by an integrated Semtech
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Coilcraft offers a broad range of wirewound ferrite beads in standard package sizes from 0201 (0603) to 1812 (4532). Elevated attenuation and frequency performance enable smaller solution sizes compared
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