Optimising parts such as cameras and processed image data, and coordinating each component’s operation, are vital to a correctly functioning high-speed system.
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Lead-free tin-silver-copper (SnAgCu), also known as SAC, has been a popular solder alloy choice for surface mount technology (SMT) assembly in the electronics industry, but its adoption for automotive applications has proved to be challenging for several reasons.
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Indium Corporation has introduced Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.
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To capture smaller leads and posts in dual-level testing, QA’s new self-cleaning 55 steel crown tip style is now available in a 0,400-inch long stroke 075-40 and X50-40 probe series.
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With predictive and targeted maintenance options to maximise uptime, Panasonic’s NPM-GH pick-and-place machine is the first step to a truly autonomous factory.
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MIRTEC’s upcoming inspection system will include two of its patent pending technologies to provide unparalleled performance, ART’s exclusive optical systems, and TAL 3D SCAN’s laser scanner.
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Indium Corporation has introduced a new jetting solder paste, the PicoShot NC-6M, which is a no-clean, halogen-free, Type 6 powder-size material.
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Compared to standard preforms, these gold-based PDA preforms offer a higher level of precision to reduce defects, control bondline thickness (BLT), and deliver high-yield performance and reliability in critical die-attach applications.
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The ASYMTEK Select Coat SL-1040 Series is Nordson Electronics Solutions’ most advanced conformal coating solution for high-volume production.
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The D-VIS and DL-VIS from GKG SMT printer specialists are high-speed dispensing systems that can handle multiple scenarios.
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The Xpection 1860 from Scienscope is a versatile X-ray inspection machine that offers comprehensive circuit board defect detection and quality assurance for the SMT industry.
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Indium8.9HF is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloys.
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