Panasonic’s VM102 is based on the AM100 component placement platform, but in a more compact form, leveraging a 14-nozzle head and up to four 20-slot feeder carts or 160 8-mm inputs, with an output of ...
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Nordson Electronics Solutions announced the new Asymtek Forte Max fluid dispensing system with high accuracy, dual-valve jetting in two modes, and patented, real-time correction to accommodate skewed ...
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Automatic generation of data for board inspection on Saki 3D AOI (automatic optical inspection) systems is now possible thanks to a new ‘Job Data Convert’ function. By using the component information ...
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GKG, a specialist manufacturer of SMT solder paste printing machines, announced that its advanced flagship printer model, G-Titan, has met the requirements of IPC-CFX-2591 and officially validated by ...
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Perhaps the most widely recognised compound of indium is indium-tin oxide (ITO). This ubiquitous compound is a transparent conductive oxide used in almost all flat panel displays and touchscreen devices. ...
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The AM100 component placement machine maintains the high standards for capability, flexibility and reliability that customers expect from Panasonic in a cost-effective, incrementally scalable, high-mix ...
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Indium continues to expand its flux portfolio with WS-823 – a one-step ball grid array (BGA) ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP ...
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Indium’s Joe Hertline, product manager – ESM/Power Electronics, will present on power electronics for electric vehicles during the CHARGED EV Engineering Virtual Conference on Wednesday 21 April 2021. ...
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Indium featured its award-winning Durafuse LT – a novel, low-temperature alloy system designed to provide high reliability in low-temperature applications – during productronica China, which was held ...
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As it continues to develop innovative solder paste solutions to meet customers’ current and emerging needs, Indium has introduced Indium12.8HF, a versatile paste engineered to deliver exceptional jetting ...
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Build the clearest understanding of electronics defects using top-down 2D, inclined-angle 2.5D, and full 3D X-ray inspection.
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With every new model of an electronic device, the internal components get smaller and smaller with more and more demand. Not surprisingly, this miniaturisation, coupled with increasing power throughput ...
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