Indium is now offering CW-305, a uniquely formulated flux-cored wire that offers superior ease of cleaning in which the post-soldering residue can be removed using only a warm water-wash. Halogen-free ...
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Saki, an innovator in the field of automated optical and X-ray inspection equipment, announced that its 3Si solder paste inspection (SPI) and 3Di automated optical inspection (AOI) solutions have been ...
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Inventory knowledge is essential for modern PCB production. Whether you are an SMT manufacturer, supplier or broker, live monitoring of inventory in your MRP system at all times minimises stock, labour, ...
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Panasonic’s SPG2 high-speed screen printing machine is tailored to SMT manufacturing and comes equipped with multi-stage board handling to improve productive time. The system’s hybrid printing technology ...
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Panasonic’s VM102 is based on the AM100 component placement platform, but in a more compact form, leveraging a 14-nozzle head and up to four 20-slot feeder carts or 160 8-mm inputs, with an output of ...
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Nordson Electronics Solutions announced the new Asymtek Forte Max fluid dispensing system with high accuracy, dual-valve jetting in two modes, and patented, real-time correction to accommodate skewed ...
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Automatic generation of data for board inspection on Saki 3D AOI (automatic optical inspection) systems is now possible thanks to a new ‘Job Data Convert’ function. By using the component information ...
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GKG, a specialist manufacturer of SMT solder paste printing machines, announced that its advanced flagship printer model, G-Titan, has met the requirements of IPC-CFX-2591 and officially validated by ...
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Perhaps the most widely recognised compound of indium is indium-tin oxide (ITO). This ubiquitous compound is a transparent conductive oxide used in almost all flat panel displays and touchscreen devices. ...
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The AM100 component placement machine maintains the high standards for capability, flexibility and reliability that customers expect from Panasonic in a cost-effective, incrementally scalable, high-mix ...
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Indium continues to expand its flux portfolio with WS-823 – a one-step ball grid array (BGA) ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP ...
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Indium’s Joe Hertline, product manager – ESM/Power Electronics, will present on power electronics for electric vehicles during the CHARGED EV Engineering Virtual Conference on Wednesday 21 April 2021. ...
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