The connectorised module includes RF preselector filters, low-noise amplifiers, programmable attenuation, LO synthesizer, power conditioning, and FPGA control.
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Matchstiq’s G20 and G40 are low SWaP-C SDRs tailored for AI and ML applications by combining an RF module, SDR, FPGA, CPU, and GPU into a single transceiver platform.
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Jariet is leading the way in direct RF-sampling of satellite bands from VHF to Ka with its integrated ultra-high speed ADCs, DACs, and PLL/VCOs, which provide the range and bandwidth necessary to cover more bands than any other approach in a single chip.
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WithWave’s high speed and high-density multi-coax cable assemblies provide a wide range of multiple coax connectors and flexible cable assemblies, with a choice of 20, 40, 50, 67 or 110 GHz configurations.
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SynQor’s ruggedised AC-DC and DC-DC converters and filters are designed for a wide range of industrial applications, including those required to withstand harsh environments.
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The Matchstiq X40 from Epiq is a high-performance low SWaP SDR optimised for AI and ML and the RF edge.
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SynQor has announced its latest 28 V DC input VPX power supply, VPX-3U-DC28TH, featuring extended hold-up designed for critical aerospace and shipboard applications.
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United Monolithic Semiconductors’ CHE1260-QAG is a bidirectional detector monolithic microwave IC (MMIC) that integrates a passive bidirectional coupler, two matched detector diodes, and two reference diodes.
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Withwave’s multi-channel SMPM cable assemblies provide a choice of 26,5, 40 or 50 GHz configurations based on precision array design and superior high-frequency cabling solutions.
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The RFS1140 from Mercury Systems is the first multi-chip module to combine the processing power of the AMD Versal AI Core series adaptive SoC, along with Jariet Technologies’ high-speed data converters.
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Atlanta Micro’s AM3228 is a passive lowpass filter implemented on chip, that provides low loss and high rejection, and excels in 18 GHz direct digitisation applications.
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This MMIC from Macom contains a two-stage reactively matched amplifier design approach, enabling high power and power added efficiency to be achieved in a 7 x 7 mm surface-mount package.
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