NXP’s MCX C04x microcontrollers feature an Arm Cortex-M0+ core up to 48 MHz and offer 32 KB Flash, 2 KB SRAM, and 8 KB boot ROM.
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KIOXIA has implemented the groundbreaking CBA (CMOS directly Bonded to Array) technology, which enables the creation of higher density devices and an industry-leading interface speed of 3,6nbsp;Gbps.
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Join Infineon for an exclusive one-hour webinar with EBV Elektronik, exploring the groundbreaking Matter standard, and its profound implications for the future of smart homes.
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Renesas has released a general-purpose MCU to enhance its existing RISC-V portfolio, and this is its first MCU using a RISC-V core developed internally at the company.
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These highly-integrated Linux and Android SoCs from Synaptics are optimised for consumer, enterprise, and industrial applications and deliver an ‘out-of-the-box’ edge AI experience.
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The chips are designed to provide a lower-cost alternative to traditional parallel SRAM products, and include optional battery backup switchover circuitry in the SRAM memory to retain data on power loss.
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The highly integrated 3,3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration.
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STMicroelectronics is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.
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SCM offers a midway latency point between DRAM and SSDs, and when coupled with the introduction of CXL, low-latency flash, such as XL-FLASH, is well-positioned to deliver improvements in price, system performance, and power consumption to everything from servers to edge devices deploying the power of AI.
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KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.
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ero-voltage switching (ZVS) flyback topology and advanced SR FET control enable 95% efficiency, together with reduced power supply size and component count.
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The company has now released its new half-bridge IGBT power modules offered in its redesigned INT-A-PAK package.
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