Renesas Electronics has expanded its RA4 Series microcontrollers (MCUs) with 12 new RA4M2 Group parts. The new devices deliver an exceptional combination of very low power consumption, high performance and enhanced security features that positions them as ideal solutions for industrial and IoT applications.
The highly power-efficient RA4M2 Group offers a market-leading operating current of only 80 µA/MHz in active mode, and low standby current of 0,7 mA. Even with these leading specifications, the new devices have an extremely fast wakeup time from standby of 30 µs. With operating frequencies up to 100 MHz, the RA4M2 MCUs are ideal for performance-hungry, low-power applications such as industrial and IoT edge devices.
The RA4M2 MCUs employ the Arm Cortex-M33 core based on Armv8-M architecture. They feature Arm TrustZone technology and Renesas’ Secure Crypto Engine. The Secure Crypto Engine incorporates multiple symmetric and asymmetric cryptography accelerators, advanced key management, security lifecycle management, power analysis resistance, and tamper detection. This combination enables customers to realise secure element functionality, enabling safety and security in IoT edge devices for low-power applications.
Key features of the RA4M2 Group are:
• Very low power consumption of 80 A/MHz in active mode; 30 µs wakeup time.
• Scalable from 48- to 100-pin LQFP packages; also available in 48-pin QFNs.
• Integrated Flash memory of 512 KB, 384 KB or 256 KB; 128 KB SRAM.
• Capacitive touch sensing unit.
• USB 2.0 Full Speed, QuadSPI and SDHI.
• Advanced analog with one ADC (analog-to-digital converter) unit.
The RA4M2 Group is supported by the easy-to-use Flexible Software Package (FSP), which includes a best-in-class HAL driver. The FSP uses a GUI to simplify and dramatically accelerate the development process, while also making it easy for customers to transition from an original 8/16-bit MCU design. Designers using the RA4M2 MCUs also have access to the extensive Arm partner ecosystem, offering a wide range of tools that help speed time-to-market.
Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...AI-ready edge MPU for HMIs Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Compact low-power 32-bit platform EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
Read more...Low-power memory born for edge AI iCorp Technologies
DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...Programmable logic redefined
DSP, Micros & Memory
Microchip’s CLB-based PIC MCUs combine programmable logic and embedded control in a single device to help reduce latency, cost, and design complexity.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version