The continuous computational demands of artificial intelligence (AI) and machine learning (ML) workloads, cloud computing and data analytics deployed on traditional parallel attached memory have reached an efficiency plateau due to the limitations of increased memory channels on a processor. Microchip Technology has therefore announced the expansion of its serial-attached memory controller portfolio with the new SMC 2000 series of Compute Express Link (CXL)-based smart memory controllers that enable CPUs, GPUs and SoCs to utilise CXL interfaces to connect either DDR4 or DDR5 memory. This solution delivers more memory bandwidth and memory capacity per core, and lowers the overall total cost of ownership in the data centre.
The low-latency SMC 2000 16 x 32G and SMC 2000 8 x 32G memory controllers are designed to CXL 1.1 and CXL 2.0 specifications, DDR4 and DDR5 JEDEC standards and support PCIe 5.0 specification speeds. The SMC 2000 16 x 32G is currently the highest-capacity controller with 16 lanes operating at 32 GT/s and supporting two channels of DDR4-3200 or DDR5-4800, resulting in a significant reduction in the required number of host CPU or SoC pins per memory channel. Typical CXL attached memory modules include 512 GB of memory or more, providing an effective mechanism to increase the memory bandwidth available to processing cores.
“Microchip is excited to introduce our first CXL-based serial memory controller device to the market,” said Pete Hazen, corporate vice president of Microchip’s data centre solutions business unit. “We identified CXL as a disruptive technology early on and it was integral to the standard’s definition. Microchip’s continued presence in the memory infrastructure market underscores our commitment to improving performance and efficiency for a broad range of SoC applications to support the increasing memory requirements of high-performance data centre applications.”
Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...AI-ready edge MPU for HMIs Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Compact low-power 32-bit platform EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
Read more...Low-power memory born for edge AI iCorp Technologies
DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...Programmable logic redefined
DSP, Micros & Memory
Microchip’s CLB-based PIC MCUs combine programmable logic and embedded control in a single device to help reduce latency, cost, and design complexity.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.