Avnet Silica has announced its cooperation with NXP Semiconductors to bring secure provisioning services to OEM and EMS customers. This consolidates the distributor’s long-standing collaboration with NXP. The cooperation allows Avnet Silica to be the first NXP programming partner to deliver the EdgeLock 2GO service for compatible devices.
The Avnet Silica secure provisioning machine is connected to NXP’s EdgeLock 2GO cloud-based solution to streamline the provisioning process of OEM devices and ensure quality of service. This joint solution allows OEM or EMS customers to configure, generate, and manage their device credentials via the NXP EdgeLock 2GO service. They can then receive the credentials already programmed into the silicon by Avnet Silica, removing the need for OEM or EMS customers to connect on their own.
The Avnet Silica and NXP EdgeLock 2GO secure provisioning solution supports key and certificate injection such as Matter certificates and cloud authentication. Other available services include secure boot mechanism injection and firmware programming for IP protection; customers also have the safety of avoiding counterfeit devices through transparent product distribution tracking.
“We have worked with NXP to enable provisioning for EdgeLock 2GO-compatible devices in our Product Modification Center in Poing, Germany. This new service allows our customers to receive securely provisioned devices. By using our secure provisioning service, OEMs have a quality-assured service and ease of traceability, to help avoid the grey market,” commented Romain Tesniere, business development manager IoT & security at Avnet Silica.
KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...Artificial intelligence meets embedded development Avnet Silica
DSP, Micros & Memory
Microchip Technology is leveraging the power of artificial intelligence (AI) to assist software developers and embedded engineers in writing and debugging code with the launch of its MPLAB AI Coding Assistant.
Read more...Embedded module for AI vision applications Rugged Interconnect Technologies
DSP, Micros & Memory
The TQMa95xxSA supports AI/ML with vision applications through an integrated NPU and an image processor unit.
Read more...High-speed Flash for SoC applications NuVision Electronics
DSP, Micros & Memory
GigaDevice has unveiled the GD25NE series of dual-power supply SPI NOR Flash chips, designed specifically for 1,2 V system-on-chip (SoC) applications.
Read more...Super-fast H.264 encoder FPGA core EBV Electrolink
DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.
Read more...ST MCUs extend ultra-low power innovation Altron Arrow
DSP, Micros & Memory
STMicroelectronics has introduced new STM32U3 microcontrollers with cutting-edge power-saving innovations that ease deployment of smart connected tech, especially in remote locations.
Read more...Chipset enables ultra-wide signal capture RFiber Solutions
DSP, Micros & Memory
Jariet Technologies has developed Electra, a chipset that enables ultra-wide, multi-function and multi-band signal capture and generation from a single component.
Read more...SoC for real-time AI at the edge Future Electronics
DSP, Micros & Memory
Ambiq’s Apollo330 Plus series is purpose-built to enable always-on and real-time AI inferencing on devices.
Read more...Evaluation kit for ML applications Future Electronics
DSP, Micros & Memory
The hardware kit includes radar, acoustic, pressure and motion sensors and integrates dual Arm Cortex-M4 and Cortex-M0+ CPU cores.