Manufacturing / Production Technology, Hardware & Services


Case study: Fast and efficient cable harness component picking and traceability

28 June 2024 Manufacturing / Production Technology, Hardware & Services

An automated robot manufacturer was looking to increase traceability and picking efficiency of components for robotic arm cable harnesses in their warehouse. Brady’s customer wanted to get rid of a historic paper-based traceability process, and wanted an efficient collection of power cables, oil tubes, control cables and other components from the warehouse to create a complete robotic arm cable harness.

Solution: Wireless label copy printing

The automated robot manufacturer contacted Brady with questions about its standard Scan & Print app that is promoted on their website. In essence, the Scan & Print app copies labels, and it is a great traceability tool for components that are collected from larger bins.

After analysing the needs together with the customer, it quickly became clear that a custom scan and print application could optimally solve the specific identification challenges involved. Every time a component is picked from a bin, the bin label is scanned. Scan data are sent to central systems. From there, data are sent back wirelessly to the picker’s portable label printer to print a label copy immediately. To ensure traceability in a fast and efficient way, label copies are applied to components, so they match the label on the bin they were sourced from. Brady specialists also built in a verification feature, which can alert when a component would be picked that does not match the work order.

Warehouse professionals were equipped with the portable BradyPrinter M611 Mobile Printer. The printer can receive data wirelessly to print them on highly resilient, industrial-grade labels that can resist a great number of production processes. The BradyPrinter M611 does not feature a keyboard, but is instead capable of printing complex labels using any smartphone as interface. It is also capable of printing labels automatically via an ERP system and Wi-Fi network.

Professionals at the automated robot manufacturer can now pick components from their warehouse more efficiently, and quickly label them for traceability purposes. The entire process is driven digitally, which presents additional options for future efficiency gains. These could include automatic component reordering with Brady’s FlexTrak inventory management system.




Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.

Read more...
MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.

Read more...
Downstream demand, system reliability, and the expanding role of engineering-led distribution
Manufacturing / Production Technology, Hardware & Services
[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.

Read more...
The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.

Read more...
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.

Read more...
Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.

Read more...
Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.

Read more...
Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.

Read more...
The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.

Read more...
Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved