With the continuous development of AI technology, the demand for computing power in data centres is rapidly increasing, which forces the AI servers and other computing equipment to demand higher power.
Due to the application of AI acceleration cards, the height of devices is more limited. This has resulted in the emergence of multi-phase,
ultra-high current copper magnetic co-fired power inductors.
These power inductors, HTF-MP, play an important role in the power supply system composed of multi-phase controllers and DrMOS. They can regulate voltage through nonlinear control, multi-phase interleaved parallel connection, and other technologies to meet the power supply needs of GPU and HBM3 modules. Therefore, HTF-MP can be used extensively in the key application stage of GPU power supply conversion of 12 V down to 0,8 - 1,3 V.
Sunlord’s multiphase co-fired power inductor HTF-MP series has upgraded the single-phase HTF-H products in terms of integrated applications. Compared with the single-phase HTF-H series, the HTF-MP series is more suitable for complex multiphase power supply applications in design,
effectively meeting the needs of ultra-thin and high-power devices, such as high-performance computing platforms and low-profile electronic devices.
Thanks to its innovative structural design, the HTF-MP series inductor has various unique and powerful advantages:
• Compared with assembled inductors, it has no acoustic noise, a lower EMI, and lower losses.
• Compared with traditional moulded inductors, it has higher magnetic permeability and better DC resistance.
• Compared with HTF-H inductors, it has higher integration and saves more space on the design of the PCB.
Quectel’s single-board computers put industrial edge computing on one PCB iCorp Technologies
Computer/Embedded Technology
Quectel Pi series of single-board computers (SBCs), designed for a broad range of industrial applications, include three compact development platforms – the Quectel Pi M1, L1, and H1 boards.
Read more...Simplifying system design iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The FGMC63N tri-band MCU Wi-Fi 6E module from Quectel addresses offers integrated connectivity across 2,4 GHz, 5 GHz, and 6 GHz bands in a compact, highly optimised design.
Read more...Low-power memory born for edge AI iCorp Technologies
DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
Read more...Compact MCU for IoT endpoints iCorp Technologies
DSP, Micros & Memory
Quectel’s FCM266D combines single-band 2,4 GHz Wi-Fi 6 with Bluetooth LE 5.4 in an ultra-compact LCC package measuring just 20 x 18 x 2,4 mm.
Read more...Cooling solutions for modern electronics Future Electronics
Passive Components
As electronic systems become more compact and powerful, effective thermal management has become a critical aspect of product design.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version