Manufacturing / Production Technology, Hardware & Services


Optimising cleaning products used in electronics manufacturing

29 November 2024 Manufacturing / Production Technology, Hardware & Services

The electronics industry is committed to improving manufacturing practices, and one way to do this is using safer and more sustainable cleaning products across the electronics manufacturing lifecycle. IPC-1402, Standard for Green Cleaners Used in Electronics Manufacturing, is for engineers, chemists, environment/health/safety professionals, purchasers, and those involved in formulating and selecting cleaning products for electronics manufacturing. Formulating safer and more sustainable cleaning products, and using these products, is an important way for the industry to reduce potential impacts to worker health and the environment.

Attendees of this online webinar will:

• Understand the utility of IPC-1402 in defining cleaning products and processes, determining impacts to humans and the environment, managing health and safety and physical hazard requirements, and how to verify and assess relevant criteria.

• Learn how to use ChemFORWARD’s new CleanScreen application and reporting tool, which incorporates IPC-1402 criteria, to rapidly screen cleaning formulations and create your product safety profile for B2B communications.

• Increase their awareness of other tools, standards, and certification programmes available to develop and market safer and more sustainable cleaners for electronics manufacturing applications.

Date: 10 November 2025

Time: 19:00 SAST




Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Downstream demand, system reliability, and the expanding role of engineering-led distribution
Manufacturing / Production Technology, Hardware & Services
[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.

Read more...
The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.

Read more...
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.

Read more...
Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.

Read more...
Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.

Read more...
Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.

Read more...
The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.

Read more...
Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.

Read more...
UV curing oven for high-efficiency PCB production
Techmet Manufacturing / Production Technology, Hardware & Services
The jCURE-2UV+ from JTU is a cutting-edge ultraviolet curing oven engineered for fast, reliable curing of UV-sensitive coatings in SMT production environments.

Read more...
Automatic stencil cleaning
ZETECH ONE Manufacturing / Production Technology, Hardware & Services
The MBtech N29 series delivers high-precision stencil cleaning with a focus on efficiency, economy and the environment, and is ideal for SMT adhesive and solder paste stencil maintenance.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved