DSP, Micros & Memory


QLC Flash memory using BiCS tech

29 November 2024 DSP, Micros & Memory

KIOXIA announced it had started shipping its 2 Tb Quad-Level-Cell (QLC) memory devices with its 8th-generation BiCS FLASH 3D flash memory technology. This 2 Tb QLC device currently has the highest capacity in the industry, elevating storage devices to a new capacity point that will drive growth in multiple application segments, including AI.

The 2 Tb QLC is equipped with a bit density around 2,3 times higher, and a write power efficiency 70% higher than KIOXIA’s current 5th-generation QLC device. With a 16-die stacked architecture in a single memory package, the latest QLC device achieves industry-leading 4 TB of capacity. It is available with a smaller package size of 11,5 x 13,5 mm and a package height of 1,5 mm.

In addition to the 2 Tb QLC, KIOXIA also added a 1 Tb QLC memory device to its portfolio. In comparison with the capacity-optimised 2 Tb QLC, the performance-optimised 1 Tb QLC offers a 30% faster sequential write performance, and a 15% improvement in read latency. The 1 Tb QLC will be deployed in high-performance applications.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Edge AI improves condition monitoring
EBV Electrolink AI & ML
STMicroelectronics has introduced the IIS3DWB10IS, an intelligent MEMS vibration sensor designed for high-performance industrial condition monitoring applications.

Read more...
Advanced sensing powers modern drones
Future Electronics DSP, Micros & Memory
Allegro MicroSystems has a portfolio of sensors, motor drivers, and power management devices specifically designed to enhance drone efficiency, reliability, and control.

Read more...
Addressing latency and signal integrity challenges
Altron Arrow DSP, Micros & Memory
Strengthening Microchip Technology’s data centre solutions portfolio, its XpressConnect retimers support high-bandwidth architectures, while helping reduce integration complexity.

Read more...
Industrial time-of-flight proximity sensor
EBV Electrolink Opto-Electronics
STMicroelectronics’ VL53L4ED is a compact, high accuracy time-of-flight proximity sensor designed for industrial and embedded applications that require precise short range distance measurement.

Read more...
Ultra-low-power smart metering
EBV Electrolink Analogue, Mixed Signal, LSI
ScioSense’s UFC23 sensor combines improved resolution and offset stability with ultra-low standby current, enabling high-end battery-powered water, heat, gas and leak detection meter designs.

Read more...
ESP32-S31 for advanced IoT
iCorp Technologies DSP, Micros & Memory
At the heart of the device is a dual-core 32-bit RISC-V MCU operating at up to 320 MHz, delivering 6,86 CoreMark/MHz performance with MMU support for efficient memory management.

Read more...
High-performance SSD storage
EBV Electrolink Telecoms, Datacoms, Wireless, IoT
Targeting the performance segment, the new KIOXIA XG10 Series leverages PCIe 5.0 technology to significantly elevate speed and responsiveness across data-intensive client applications.

Read more...
Cortex-M33 performance for cost-sensitive designs
Future Electronics DSP, Micros & Memory
The STM32C5 series from STMicroelectronics introduces a new generation of entry-level microcontrollers engineered to deliver enhanced processing capability, modern security, and cost-effective scalability for connected embedded applications.

Read more...
Memory shortage 2026: Engineering implications for South Africa
DSP, Micros & Memory
[Sponsored] Addressing this challenge requires system-level thinking and adoption with McKinsey Electronics providing the engineering and sourcing framework required to maintain system resilience despite ongoing global constraints.

Read more...
Cost-effective microcontroller series
Altron Arrow DSP, Micros & Memory
The STM32C5 series from STMicroelectronics delivers an excellent balance of performance, efficiency, and affordability for embedded designs that require more capability without increasing bill of materials cost.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved