AI & ML


New platforms that deliver advanced edge AI capabilities

29 November 2024 AI & ML

VIA Technologies has launched three new high-performance edge AI solutions: the SOM-5000, VAB-5000, and ARTiGO A5000. These platforms are designed to meet the growing demand for intelligent edge computing across a wide range of industrial, commercial, and consumer applications.

“These new platforms represent a significant leap forward in edge AI technology,” said Epan Wu, general manager, VIA Intelligent Solutions. “With their advanced processing capabilities and versatile connectivity options, the SOM-5000, VAB-5000, and ARTiGO A5000 enable our customers to develop innovative and efficient edge AI applications.”

The VIA SOM-5000 is a fanless, low-power system-on-module designed for advanced edge AI applications. Powered by the MediaTek Genio 700 Octa-Core SoC, it features an integrated AI processor for high-efficiency Edge AI tasks, 4K hardware-accelerated H.265/H.264 video processing, support for dual displays and dual MIPI CSI-2 cameras, and optional 4G LTE mobile broadband with onboard M.2 and SIM card slots for enhanced connectivity.

The VIA VAB-5000 is a versatile Pico-ITX board engineered for flexible Edge AI deployments. Featuring the MediaTek Genio 700 Octa-Core SoC, it includes the MediaTek Deep Learning Accelerator 3.0 and Vision Processor 6 APU for advanced AI processing, 4K hardware-accelerated H.265/H.264 video encoding and decoding, and compatibility with MIPI CSI, AHD cameras, and eDP/LVDS displays. Extensive I/O options including a 40-pin Raspberry Pi-type GPIO header.

The VIA ARTiGO A5000 is an ultra-compact system crafted for edge AI applications, also powered by the MediaTek Genio 700 Octa-Core processor. It offers an integrated AI processor for sophisticated Edge AI applications, 4K hardware-accelerated H.265/H.264 video encoding and decoding, dual-band Wi-Fi 6 and Bluetooth 5.2 for robust connectivity, and comprehensive I/O options including HDMI, USB 3.1, and a MicroSD card slot.




Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Read more...
SoC brings scalable edge AI to life
Altron Arrow AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.

Read more...
Wall-mount cooling for Edge IT
AI & ML
Designed to run 24/7 in critical compute environments, Vertiv CoolPhase Wall delivers up to 60% greater airflow than comfort cooling.

Read more...
Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow Opto-Electronics Electronics Technology AI & ML
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Read more...
Edge AI improves condition monitoring
EBV Electrolink AI & ML
STMicroelectronics has introduced the IIS3DWB10IS, an intelligent MEMS vibration sensor designed for high-performance industrial condition monitoring applications.

Read more...
Tiny SoM integrates NXP i.MX 91
AI & ML
The QS91 module from Direct Insight utilises the low-cost single core i.MX 91 to deliver secure, energy-efficient Linux capabilities for edge applications.

Read more...
Robotics platform powers intelligent systems
Vepac Electronics AI & ML
The CEXD-INTRBL open robotics development system combines high-performance AI processing, sensor integration, and motion control into a compact embedded platform.

Read more...
SensorGPT speeds intelligent IoT deployment
AI & ML
TDK has introduced SensorGPT, a new technology designed to accelerate the deployment of intelligent edge AI and smart IoT applications by dramatically reducing reliance on real-world sensor data.

Read more...
Ideal entry point into edge AI
Avnet Silica AI & ML
congatec has released new COM Express modules with Intel Core Series 3 processors for cost- and energy-optimised embedded computing applications.

Read more...
Analogue reservoir AI chip capable of real-time learning
Altron Arrow AI & ML
TDK Corporation has jointly developed a prototype of a reservoir AI chip using an analogue electronic circuit that mimics the cerebellum with Hokkaido University.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved