News


Supercapacitor development improves energy retention

27 May 2009 News

Research into efficient charge storage mechanisms has always been an area of interest to the electronics industry, specifically for application segments such as consumer electronics.

The ability to charge a storage device and maintain the charge over a considerable amount of time have been the two most important performance markers of any charge storage technology.

Over the past decade, supercapacitors have been an area of interest to the research fraternity focusing on development of highly efficient battery technologies. Supercapacitors, or ultracapacitors, are electrochemical capacitors that have an extremely high energy density.

While supercapacitors have made a performance mark through their ability to acquire charge at very high speeds, industrial experts feel that there is still a lot of potential to improve their retention capacity. In the current scenario, even the best of the supercapacitors discharge at a very high rate, restricting their dominance in the industrial space.

In an attempt to improve the retention capability of supercapacitors, a team of researchers from the University of California in Los Angeles has developed a manufacturing process for supercapacitors that is said to improve their retention capacity. The process employs single walled carbon nanotubes (SWCNTs). Nanotubes are considered to have the potential to replace conventionally used silicon in applications such as CPUs, memories and radio circuits, due to their small size and very encouraging electrical characteristics.

Traditional supercapacitors are manufactured in layers with a viscous solution between plates, similar to a capacitor. When a voltage is applied across the two electrodes, the positive ions head very quickly to one electrode, and the negative ones to another, building up a charge. This process helps the supercapacitor to store energy at a faster rate, but doesn’t provide resistance from discharging.

In the new process suggested by the team from UCLA, carbon nanotubes were sprayed onto plastic films and two such films were sandwiched between an electrolyte of a water-soluble synthetic polymer, phosphoric acid and water. As a result, an ultrathin supercapacitor is formed, which is in the order of micrometres. This process prevents the supercapacitor from discharging too quickly.

The current implementation of this manufacturing process yields an equivalent of 70 kilowatts per kilogram of energy (9 watt hours per kilogram) – well below the power available in traditional lithium-ion batteries, due to energy losses seen when discharging the supercapacitor. An unusually high resistance exists when energy is moved into or out of the device.

The team is working on resolving these issues, and this effort is expected to result in super thin capacitors, which can be very large and rectangular, about 1 mm thick, making them suitable for use in extremely thin cellphones and mobile gadgets. As these supercapacitors power devices for an extended time period, they can also be charged via remote magnetic fields that do not require wires. As these carbon nanotube-based supercapacitors have properties such as fast charging, reliability, long-term cycling, and the ability to deliver significantly more power than batteries, they are expected to find application in power saving features in CPUs.

For more information contact Patrick Cairns, Frost & Sullivan, +27 (0)21 680 3274, patrick.cairns@frost.com, www.frost.com





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Hitachi reinvents asset management solution
News
Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.

Read more...
Mycronic releases mixed Q4 results
News
Mycronic reported mixed Q4 results for the year ended January to December 2025, while delivering record full year order intake and net sales.

Read more...
AGOA: Businesses should diversify or face significant exposure
News
Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).

Read more...
European components distribution growing
News
European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.

Read more...
Silicon Labs reports strong growth
News
Silicon Labs has reported robust financial results for the fourth quarter and full year 2025, with significant YoY revenue gains and shifting market dynamics.

Read more...
Siemens acquires Canopus AI
ASIC Design Services News
The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.

Read more...
Micron breaks ground on new wafer fabs
News
Micron Technology has advanced two major semiconductor manufacturing initiatives that together reflect the company’s strategic response to sustained global demand for memory solutions.

Read more...
Texas Instruments announces planned acquisition of Silicon Labs
News
Texas Instruments Incorporated and Silicon Laboratories recently announced a definitive agreement under which Texas Instruments will acquire Silicon Labs, combining two leaders in semiconductor technology.

Read more...
AI-fueled supercycle doubles memory market revenue
News
The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.

Read more...
Research agreement for EUV tech
News
Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved