AI & ML

• Flash for AI

Circuit & System Protection

• Clearing the Static: The importance of ESD wrist straps

• Varistors for automotive applications

Computer/Embedded Technology

• 1.6T Ethernet IP solution to drive AI and hyperscale data centre chips
• Duxbury unveils next-gen solar-powered switches
• Hardened-grade network switches

• Maximising edge computing
• Ryzen V3000 computer on module
• Switched mezzanine card for enhanced Ethernet connectivity

Design Automation

• New Studio 6 SDK

DSP, Micros & Memory

• Low SWaP-C SoM for AI
• Nordic expands nRF91 series

• PolarFire SoC Discovery Kit
• Powering up the intelligent edge
• The 8-bit survival syndrome – part 1

Enclosures, Racks, Cabinets & Panel Products

• Stainless steel pushbutton enclosures

Interconnection

• Centralised distribution for M8 and M12 connectors

• High-density multicoax cable assembly
• Multi-head battery contacting solutions

Manufacturing / Production Technology, Hardware & Services

• Analog Devices and Mouser collaborate on eBook
• Flexible printed electronics substrates
• High-speed multi-function dispensing
• Lead-free solder paste
• Optical inspection for SMT
• Revolutionising clean air in electronics manufacturing

• Yamaha introduces upgrades to its 3D AOI systems
• High-mix SMT solution from Panasonic
• High-performance conformal coater
• Improved precision laser marking
• Intelligent electronics assembly
• Optimising AOI performance

Opto-Electronics

• Mouser broadens its LED lineup

Power Electronics / Power Management

• Dual-port USB-C power delivery solution
• Microchip expands its mSiC solutions

• High-power three-phase supplies
• Motor protection relay front-end
• Parallel redundancy power module

Telecoms, Datacoms, Wireless, IoT

• 18 W monolithic microwave amplifier
• 3D depth sensing sensor
• Antennas to meet all connectivity requirements

• Introducing SIMCom’s new A7673X series
• LoRaWAN-certified sub-GHz module
• Quectel announces module for RedCap comms
• Duxbury launches a cellular coverage solution