Espressif Systems is entering the Wi-Fi 6E market, extending its connectivity portfolio into the domain of high-throughput, low-latency wireless solutions.
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Quectel’s FCS950R is a high-performance Wi-Fi 5 and Bluetooth 4.2 module that can deliver a maximum data rate up to 433,3 Mbps in 802.11ac mode.
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The nRF54LM20A from Nordic Semiconductor is a multiprotocol wireless System-on-Chip designed for demanding designs in Bluetooth devices.
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New SKY53510/80/40 family of clock fanout buffers from Skyworks are purpose-built for data centres, wireless networks, and PCIe Gen 7 applications.
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Designed to eliminate the need for external biasing, the ZSD3001 from Advanced Microwave streamlines system integration and delivers exceptional sensitivity, broad frequency coverage, and low distortion.
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Advanced Semiconductor Business (ASB) has released an extensive update to its RF and microwave product portfolio, targeting applications in wireless communications, broadcast, satellite, and military systems.
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SEACOM aims to explore an innovative new concept: utilising submarine cable technology to address the longstanding challenges in Africa’s terrestrial infrastructure.
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Siemens Digital Industries Software recently announced that Veloce Strato CS and Veloce proFPGA CS have been deployed at Arm, a longtime user of Veloce, as part of its design flow for Arm Neoverse Compute Subsystems.
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Microchip expands space-qualified FPGA portfolio with new RT PolarFire device qualifications and SoC availability.
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The HM-BT4531 from HOPERF is a BLE data transmission module that features an ARM Cortex-M0 32-bit processor.
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[Sponsored] Across the world, emerging markets are no longer standing at the edge of the technology race. They are shaping it, influencing priorities, and building the systems that will define tomorrow.
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Silanna Semiconductor has released its first evaluation kits for the Plural data converter family to offer the fastest, most cost-effective way to evaluate and deploy high-performance ADCs.
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Gen 3 SiC Schottky diodes from Vishay in the compact SlimSMA HV package increase efficiency while enhancing electrical insulation.
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TDK Corporation has introduced a variety of new large-size ferrite cores with different core shapes, making this the industry’s largest lineup of shapes, sizes, and materials for such large cores.
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Built for rugged reliability, the Mibbo MFC Series delivers stable, efficient power in environments where moisture, dust, and temperature extremes are everyday challenges.
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GAIA Converter has introduced the MGDM-500/P power module with a new parallel option for scalable power solutions up to 3 kW.
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[Sponsored] PCBWay is thrilled to announce a highly anticipated new service - transparent rigid PCBs – a combination of technology and aesthetics.
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[Sponsored] As data rates move well into the hundreds of gigabits per second, success increasingly depends on an invisible but critical factor: impedance.
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