The company unveiled its next-generation portfolio featuring Cat 1 bis, satellite NTN, and advanced LTE-M/NB-IoT with edge AI, delivering secure and resilient connectivity across billions of IoT devices.
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5G, the 5th generation of wireless broadband technology, enables users to establish reliable connectivity, which in turn enables flexible, autonomous, and efficient processes from production to logistics.
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This agreement between Avent Silica and Thales covers the latter’s eSIM solutions that are compliant with GSMA SGP.22 and SGP.32 standards.
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OMRON’s BU_2SW and BU_2RWL series UPS systems are engineered to offer a robust, online type power architecture designed to safeguard sensitive AC powered systems across a wide range of industries.
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Over more than six decades, IMP Electronics Solutions has built a reputation for technical expertise, reliable supply chains, and strong partnerships with both customers and manufacturing partners.
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Nitrogen in reflow soldering is often seen as a performance enhancer, offering improved wetting, shinier joints, and fewer defects. But it is not always necessary.
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When electronic components face the relentless demands of heavy industry or unpredictable outdoor elements, Takachi’s IP67 diecast aluminium enclosures provide a robust line of defence.
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New fuel gauge solution from Nordic delivers State-of-Health reporting, adaptive battery modelling, and seamless fleet observability via nRF Cloud.
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IOT Electronics has announced a new strategic partnership with Powell Electronics, becoming an Official Authorised Reseller in South Africa.
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By combining multiple soldering technologies within a single system, the Vision TripleX system enables manufacturers to adapt easily to different assembly requirements, board designs, and production volumes.
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The Aurora Reflow Oven Platform from BTU International is a next generation thermal processing system engineered for modern electronics manufacturing environments.
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The new tool, Print Param Decision Assist, automatically inspects the board file when loaded to calculate ideal printing parameters and troubleshoot existing settings.
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Siemens recently announced that Inventec Corporation has adopted Siemens’ Valor NPI software and Process Preparation X solutions from the Siemens Xcelerator portfolio to strengthen its design-for-manufacturing efficiency.
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Siemens recently announced LOGO! 9, the latest generation of its compact logic controller designed for small automation projects in both industrial and building applications.
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Engineered for high-speed, high-accuracy applications, the ESE ES-FA1 solder paste printer eliminates the traditional bottlenecks of manual stencil changes and paste management, making it an ideal solution for Tier 1 EMS providers and advanced semiconductor assembly.
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The VP2200-100 vacuum inline vapour phase soldering system from ASSCON is designed for fully automated, high-volume electronics manufacturing where process consistency and solder joint quality are critical.
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These models from Hammond Manufacturing, the 1590TRP and 1590STP, provide additional flexibility for product designers who require strong aluminium enclosures, but want alternatives to the traditional rectangular form factor.
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Delivering up to 6 A of continuous output current, the DCP0606Y from STMicroelectronics enables efficient regulation of low-voltage rails commonly used in modern vehicle electronics and industrial systems.
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