By considering factors such as mechanical headroom, damping, and system-level robustness, designers can ensure that the chosen sensor not only survives, but performs reliably over time.
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MeiG Smart has launched its first 5G Mobile HotSpot solution, the SRT8710, a breakthrough in mobile connectivity that combines ultra-fast 5G communications with integrated multimodal artificial intelligence functions.
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AMD’s Kintex UltraScale+ FPGA family delivers high-performance, mid-range field programmable gate arrays that balance price, performance, and power efficiency for demanding DSP applications.
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The AD9084 from Analog Devices integrates a quad 16-bit RF digital-to-analogue converter with a maximum sampling rate of 28 GSPS and a quad 12-bit RF analogue-to-digital converter.
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TE Connectivity’s DEUTSCH connector range offers high-performance interconnect solutions engineered for demanding environments where reliability and durability are essential.
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Mill-Max has introduced an expansion to its Omniball spring-loaded contact range with a new series of through-hole mount Omniball pins designed for robust and versatile interconnect solutions.
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Vacuum forming ESD
Electronic components can be damaged by electrostatic discharges. To protect against such damage, electronic assembly parts are often transported or stored in vacuum formed component
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As we welcome the first issue of Dataweek in a new year, it is an exciting time to be part of the electronics community, especially for our readers. The pace of change across our industry continues to accelerate, reshaping how we design, build, and interact with technology.
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European electronic components distribution returned to growth in the fourth quarter of 2025, according to newly released figures from DMASS Europe.
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The acquisition extends Siemens’ comprehensive EDA software portfolio with computational metrology and inspection to help chipmakers solve critical technical challenges in semiconductor manufacturing.
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Panasonic TOUGHBOOK 33 2-in-1 detachable The Panasonic TOUGHBOOK 33 is a fully rugged 12-inch 2-in-1 detachable notebook designed to deliver unmatched flexibility, durability, and performance for mobile professionals working in demanding environments.
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Quad-Apollo MxFE reference design The Quad-Apollo MxFE reference design exemplifies a complete, high-performance platform for every-element direct-RF sampling digital beamforming using Analog Devices’ Apollo mixed-signal front-end technology.
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EMI shielding materials application guide TE Connectivity’s shielding solutions include electrically conductive elastomers, gaskets, knitted wire mesh, oriented wire, EMI shielding ventilation panels, shielded window, cable shielding and shielding components.
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Redefining edge intelligence in RF analysis The HAROGIC PXR Series bridges the gap between benchtop-grade RF performance and high-performance edge computing.
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Premium rework station The JBC DDSD 2-Tool Rework Station with DT530 is a premium, versatile solution for demanding soldering and desoldering tasks in electronics assembly and repair.
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Super low-voiding solder paste The KOKI SB6NX58-G850 solder paste is a high-reliability, super low-voiding SMT soldering material engineered for demanding electronics assembly.
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Vectorguard stencil frames The Vectorguard uses a unique tensioning system that, unlike other tensioning systems, is not pressure dependent making it completely independent of traditional pneumatic processes.
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The Hakko FX-973 is a high-performance, multi-functional electronics rework station ideal for PCB assembly, repair, and precision soldering/desoldering tasks.
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