Wi-Fi 7, the IEEE 802.11be standard also known as Extremely High Throughput, is the next-gen wireless networking standard designed to dramatically improve speed, latency, efficiency, and reliability.
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As the demand for intelligent, connected, and energy-efficient systems grows, embedded engineers are under pressure to design faster, smarter, and more secure products
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The ISM6HG256X is a 6-axis intelligent inertial measurement unit that enables smart motion sensing, edge computing, and real-time awareness.
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GigaDevice has announced the official launch of the GD32F503/505 high-performance series of 32-bit general-purpose microcontrollers based on the Arm Cortex-M33 core.
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The QuecPi Alpha smart MOB development board is Quectel’s smart development board based on Qualcomm’s QCS6490 high-performance 64-bit octa-core processor.
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The QSM560DR series is Quectel’s multi-mode 5G smart control panel with built-in Ubuntu/Android/Windows operating system based on the Quectel SG560D series smart module.
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Silicon Labs recently unveiled a new way it is helping developers and their AI agents collaborate through its Simplicity AI SDK.
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To prevent Electrostatic Discharge (ESD) damage to sensitive electronic assemblies and components, all production, handling, packaging, and storage must take place in an ESD-protected environment.
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For South Africa in particular, 2025 has been a year that highlighted the resilience and adaptability of our engineering community as we navigated shifting technologies and a fast-moving international landscape
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South African companies exporting IoT devices to the European Union face a significant regulatory shift with the Cyber Resilience Act becoming mandatory in December 2027.
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The HM-BT220X from HOPERF is a Bluetooth Low Energy data transmission module, based on a BLE 5.2 SoC chip with an integrated ARM Cortex-M33 processor.
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[Sponsored] Across the world, emerging markets are no longer standing at the edge of the technology race. They are shaping it, influencing priorities, and building the systems that will define tomorrow.
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Silanna Semiconductor has released its first evaluation kits for the Plural data converter family to offer the fastest, most cost-effective way to evaluate and deploy high-performance ADCs.
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Gen 3 SiC Schottky diodes from Vishay in the compact SlimSMA HV package increase efficiency while enhancing electrical insulation.
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TDK Corporation has introduced a variety of new large-size ferrite cores with different core shapes, making this the industry’s largest lineup of shapes, sizes, and materials for such large cores.
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Built for rugged reliability, the Mibbo MFC Series delivers stable, efficient power in environments where moisture, dust, and temperature extremes are everyday challenges.
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GAIA Converter has introduced the MGDM-500/P power module with a new parallel option for scalable power solutions up to 3 kW.
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[Sponsored] PCBWay is thrilled to announce a highly anticipated new service - transparent rigid PCBs – a combination of technology and aesthetics.
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