Welcome to the July 2026 issue of Dataweek. As you can see from this introduction, Dataweek’s regular editor, Peter Howells, is on extended leave and I am filling the void in his editor’s column – hopefully without being too boring.
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The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
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nRF Cloud identifies vulnerabilities in firmware and shows exactly which deployed devices are affected, empowering device manufacturers to address EU Cyber Resilience Act requirements.
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As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
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Microtronix South Africa cements its commitment to local manufacturing with ongoing investments in production capacity, skills development, and job creation.
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IFA Berlin 4-8 September Berlin, Germany The IFA will showcase the latest in consumer electronics, home appliances, and technology. It creates a space where global innovators, thought leaders, and ...
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Zetech One recently supplied and installed an Essegi Automation smart storage management solution, the Uniflex Series and Auto Incoming station, at Etion Create’s facility in Irene, Pretoria.
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With silver price volatility increasing and sustainability requirements accelerating across semiconductor assembly, MacDermid Alpha Electronics Solutions introduces ATROX CD 560-1, a zero per- and polyfluoroalkyl substance (PFAS) alternate silver filler die attach paste.
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Microchip’s CLB-based PIC MCUs combine programmable logic and embedded control in a single device to help reduce latency, cost, and design complexity.
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The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
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Quectel’s FCM266D combines single-band 2,4 GHz Wi-Fi 6 with Bluetooth LE 5.4 in an ultra-compact LCC package measuring just 20 x 18 x 2,4 mm.
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The Scienscope AXl-6100 series comprises specialised X-ray inspection systems explicitly engineered for the examination of long circuit boards.
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Introducing the CLT-FG, a new series of compact all-in-one SMT placement machines
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The AM3269 from Mercury Systems is a high-performance RF preselector module designed to improve receiver sensitivity and signal integrity in demanding electronic warfare, signals intelligence, test, and communications applications.
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The PeakTech 6168 switching power supply is a versatile and reliable solution designed for professional applications in laboratories, development environments, service centres, and training facilities.
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The Qorvo QPC6188 is a high-performance absorptive SP4T RF switch designed to meet the demanding requirements of modern wireless infrastructure and high-frequency communication systems.
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nRF Cloud identifies vulnerabilities in firmware and shows exactly which deployed devices are affected, empowering device manufacturers to address EU Cyber Resilience Act requirements.
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Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.
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