With just two weeks remaining before the Africa Energy Indaba opens its doors in Cape Town, anticipation is building for what is expected to be one of the continent’s most influential energy gatherings.
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Dragino is a globally recognised leader in LoRaWAN and Internet of Things products and solutions, and is known for delivering reliable, cost-effective hardware.
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With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
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The Africa Energy Indaba will open its 2026 Conference with a high-level plenary panel addressing one of the continent’s most urgent challenges: Energy Access and Energy Poverty – Mission 300M.
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Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
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Pretoria-based electronics company Etion Create is showing a new range of innovative solutions, including cybersecurity systems at the third edition of World Defense Show (WDS2026) in Riyadh, Saudi Arabia.
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The Indaba convenes senior government leaders, utilities, regulators, project developers, financiers, DFIs, investors, and technology providers from across Africa and the world to engage directly on investment-ready energy projects, enabling policy frameworks, and the partnerships required to unlock delivery at scale.
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This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.
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The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
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ioTech recently unveiled the io600 inline digital laser material deposition system at productronica 2025.
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[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.
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The SAKI 3D-CT AXI stands at the forefront of automated X-ray inspection technology, delivering excellent performance for SMT, through-hole, and semiconductor inspection processes.
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The Hakko HF-600 Auto Soldering System is a high-performance soldering solution designed for automated and semi-automated production environments.
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Seika’s Sawa 5000GUS combines speed, performance and affordability, delivering reliable stencil cleanliness and consistent print quality with minimal setup and operator effort.
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Mycronic’s BA 01 small dot ejector delivers unmatched precision in solder paste jet printing for advanced PCB designs.
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The Europlacer atom ii-A1 is a compact, ultra-flexible surface mount technology placement module designed to bring precision and productivity to electronic assembly lines.
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The Hanwha Semitech HM520W is a premium flexible chip mounter engineered to deliver high productivity, placement precision, and operational convenience across a wide range of SMT production environments.
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The Essegi ISM UltraFlex 3600 is an advanced intelligent storage solution designed to optimise component management in high-speed PCB assembly environments.
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