Gelest, Inc., a Mitsubishi Chemical Group company, recently announced a research agreement with IBM to test Gelest precursor materials for dry resist EUV lithography.
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The IO-Link couplers from Phoenix Contact are industrial contactless couplers designed to transmit power and IO-Link data across a small air gap without physical connectors.
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Designed for precision agriculture, the RAKwireless SensorHub is a modular, industrial-grade IoT platform that collects real-time environmental and soil data across farming operations.
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Microchip’s MCPF1525 power module with PMBus delivers 25 A DC-DC power and is stackable up to 200 A.
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Cross-border payments platform Verto has called on South African and African businesses to accelerate their transition toward a “post-AGOA” trade strategy following President Donald Trump’s signing of a one-year extension to the African Growth and Opportunity Act (AGOA).
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Hitachi Energy, in collaboration with Microsoft, is accelerating the digital transformation of essential infrastructure - from electricity networks and transportation corridors to heavy industrial operations - by reinventing how critical assets are managed and maintained.
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The ongoing surge in artificial intelligence is set to propel both the memory and wafer foundry sectors to unprecedented revenue levels by 2026, according to TrendForce.
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The ongoing global shortage of memory and storage components is continuing to push up technology prices in South Africa, with local distributors feeling the effects of sustained international demand.
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Quectel’s RG255C-NA and RM255C-GL modules represent a strategic move into this fast-growing segment, delivering Sub-6 GHz 5G connectivity optimised for mid-tier IoT applications.
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The Taoglas AHP2356A is a compact, high-performance active GNSS patch antenna designed for next-generation positioning systems requiring precision, reliability, and multi-constellation support.
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Purpose-built to meet the demands of next-generation IoT and wireless broadband, these modules leverage the cutting-edge Qualcomm X85 and X82 5G Modem-RF systems to deliver enterprise-grade performance.
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Links Field Networks’ portfolio includes connectivity platforms, edge devices, and network management tools designed to support secure, resilient IoT deployments across a range of use cases.
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The TI TPS7A57-Q1 is an automotive-grade, high-performance low-dropout linear regulator, engineered for precision power delivery in noise-sensitive systems.
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PowerGood’s latest range of DC-DC brick-type converters is engineered specifically for high-end applications, providing a versatile power output from 50 W to 600 W.
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The DCP3601 from STMicroelectronics is a wide-input, synchronous step-down DC-DC converter designed for compact and efficient power conversion in industrial and embedded systems.
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iCorp Technologies has introduced the AIPUPOWER ZCD100 and ZCD150 Series, a family of rugged DC-DC converters designed to meet the demanding electrical and environmental requirements of railway and transportation systems.
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onsemi’s NTMFSC2D6N08X is a high-performance 80 V N-channel power MOSFET engineered for demanding switching and power conversion applications.
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TDK Corporation has announced the B3271xP series of DC link film capacitors, offering high thermal robustness for demanding automotive and industrial power electronics.
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